
RFN1L7SDDTE25
ActiveRohm Semiconductor
RECTIFIER, AEC-Q101, 0.8A, 700V, SOD-106 ROHS COMPLIANT: YES

RFN1L7SDDTE25
ActiveRohm Semiconductor
RECTIFIER, AEC-Q101, 0.8A, 700V, SOD-106 ROHS COMPLIANT: YES
Description
General part information
RFN1L7 Series
ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN1L7SDDTE25 |
|---|---|
| Current - Average Rectified (Io) | 800 mA |
| Current - Reverse Leakage | 1 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SMA, DO-214AC |
| Package Name | PMDS |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 80 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 700 V |
| Voltage - Forward (Vf) (Max) | 1.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Moisture Sensitivity Level - Diodes
Notes for Temperature Measurement Using Thermocouples
Method for Monitoring Switching Waveform
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Importance of Probe Calibration When Measuring Power: Deskew
How to Select Reverse Current Protection Diodes for LDO Regulators
How to Use LTspice® Models: Tips for Improving Convergence
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Power Loss and Thermal Design of Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
About Export Regulations
Judgment Criteria of Thermal Evaluation
Package Dimensions
Absolute Maximum Rating and Electrical Characteristics of Diodes
Two-Resistor Model for Thermal Simulation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
What Is Thermal Design
Measurement Method and Usage of Thermal Resistance RthJC
Condition of Soldering / Land Pattern Reference
Impedance Characteristics of Bypass Capacitor
ESD Data
Part Explanation
Inner Structure
List of Diode Package Thermal Resistance
Report of SVHC under REACH Regulation
Compliance of the RoHS directive
Diode Types and Applications
What is a Thermal Model? (Diode)
About Flammability of Materials
Basics of Thermal Resistance and Heat Dissipation
Notes for Calculating Power Consumption:Static Operation
Explanation for Marking
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Taping Information
Reliability Test Result
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Use LTspice® Models
How to Select Rectifier Diodes
PCB Layout Thermal Design Guide
Anti-Whisker formation - Diodes