Specification	678-39-C

Attachment Method	Clip, Solder Foot
Fin Height	1.52 in
Length	2.362 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC...), BGA, ASIC, LGA, CPU, Assorted (BGA
Shape	Fins, Rectangular
Thermal Resistance	0.6 °C/W
Type	Vertical, Board Level
Width	0.984 in

678-39 Series

Part	Material	Package Cooled	Shape	Attachment Method	Fin Height	Type	Width	Length	Thermal Resistance	Material Finish
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Fins Rectangular	Clip Solder Foot	1.52 in	Board Level Vertical	0.984 in	2.362 in	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Fins Rectangular	Board Mounts Bolt On	1.52 in	Board Level Vertical	0.984 in	2.362 in	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-C	Aluminum	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Fins Rectangular	Clip Solder Foot	1.52 in	Board Level Vertical	0.984 in	2.362 in	0.6 °C/W	Black Anodized
Wakefield Thermal Solutions 678-39-S	Aluminum	ASIC ASIC...) Assorted (BGA BGA CPU LGA	Fins Rectangular	Board Mounts Bolt On	1.52 in	Board Level Vertical	0.984 in	2.362 in	0.6 °C/W	Black Anodized

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