678-39 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK TO-220/TO-247 W/CLIP
| Part | Material | Package Cooled | Shape | Attachment Method | Fin Height | Type | Width | Length | Thermal Resistance | Material Finish |
|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Aluminum | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Fins Rectangular | Clip Solder Foot | 1.52 in | Board Level Vertical | 0.984 in | 2.362 in | 0.6 °C/W | Black Anodized |
Wakefield Thermal Solutions | Aluminum | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Fins Rectangular | Board Mounts Bolt On | 1.52 in | Board Level Vertical | 0.984 in | 2.362 in | 0.6 °C/W | Black Anodized |
Wakefield Thermal Solutions | Aluminum | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Fins Rectangular | Clip Solder Foot | 1.52 in | Board Level Vertical | 0.984 in | 2.362 in | 0.6 °C/W | Black Anodized |
Wakefield Thermal Solutions | Aluminum | ASIC ASIC...) Assorted (BGA BGA CPU LGA | Fins Rectangular | Board Mounts Bolt On | 1.52 in | Board Level Vertical | 0.984 in | 2.362 in | 0.6 °C/W | Black Anodized |