Specification	XC3S1400AN-4FG676I

Mounting Type	Surface Mount
Number of Gates	1400000
Number of I/O	502
Number of LABs/CLBs	2816
Number of Logic Elements/Cells	25344
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	676-BGA
Package Length	27 mm
Package Name	676-FBGA
Package Width	27 mm
Total RAM Bits	589824 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

XC3S1400 Series

Part	Total RAM Bits	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Number of Logic Elements/Cells	Package / Case	Mounting Type	Number of LABs/CLBs	Package Width	Package Name	Package Length	Number of Gates	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O
AMD / Xilinx XC3S1400A-4FGG484C	589824 bits	1.14 V	1.26 V	25344	484-BBGA	Surface Mount	2816	23 mm	484-FBGA	23 mm	1400000	85 °C	0 °C
AMD / Xilinx XC3S1400AN-4FGG676I	589824 bits	1.14 V	1.26 V	25344	676-BGA	Surface Mount	2816	27 mm	676-FBGA	27 mm	1400000	100 °C	-40 °C	502
AMD / Xilinx XC3S1400A-4FG484I	589824 bits	1.14 V	1.26 V	25344	484-BBGA	Surface Mount	2816	23 mm	484-FBGA	23 mm	1400000	100 °C	-40 °C
AMD / Xilinx XC3S1400AN-5FGG676C	589824 bits	1.14 V	1.26 V	25344	676-BGA	Surface Mount	2816	27 mm	676-FBGA	27 mm	1400000	85 °C	0 °C	502
AMD / Xilinx XC3S1400AN-4FG676I	589824 bits	1.14 V	1.26 V	25344	676-BGA	Surface Mount	2816	27 mm	676-FBGA	27 mm	1400000	100 °C	-40 °C	502
AMD / Xilinx XC3S1400A-5FGG484C	589824 bits	1.14 V	1.26 V	25344	484-BBGA	Surface Mount	2816	23 mm	484-FBGA	23 mm	1400000	85 °C	0 °C
AMD / Xilinx XC3S1400AN-4FGG676C	589824 bits	1.14 V	1.26 V	25344	676-BGA	Surface Mount	2816	27 mm	676-FBGA	27 mm	1400000	85 °C	0 °C	502

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