XC3S1400 Series
Manufacturer: AMD / Xilinx
IC FPGA 375 I/O 484FBGA
| Part | Total RAM Bits | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Number of Logic Elements/Cells | Package / Case | Mounting Type | Number of LABs/CLBs | Package Width | Package Name | Package Length | Number of Gates | Operating Temperature (Max) | Operating Temperature (Min) | Number of I/O |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 484-BBGA | Surface Mount | 2816 | 23 mm | 484-FBGA | 23 mm | 1400000 | 85 °C | 0 °C | |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 676-BGA | Surface Mount | 2816 | 27 mm | 676-FBGA | 27 mm | 1400000 | 100 °C | -40 °C | 502 |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 484-BBGA | Surface Mount | 2816 | 23 mm | 484-FBGA | 23 mm | 1400000 | 100 °C | -40 °C | |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 676-BGA | Surface Mount | 2816 | 27 mm | 676-FBGA | 27 mm | 1400000 | 85 °C | 0 °C | 502 |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 676-BGA | Surface Mount | 2816 | 27 mm | 676-FBGA | 27 mm | 1400000 | 100 °C | -40 °C | 502 |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 484-BBGA | Surface Mount | 2816 | 23 mm | 484-FBGA | 23 mm | 1400000 | 85 °C | 0 °C | |
AMD / Xilinx | 589824 bits | 1.14 V | 1.26 V | 25344 | 676-BGA | Surface Mount | 2816 | 27 mm | 676-FBGA | 27 mm | 1400000 | 85 °C | 0 °C | 502 |