Specification	HMTMS-108-01-G-S-230

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Length - Mating	0.23 in
Contact Length - Post	0.12 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	8
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.45 in
Pitch - Mating	0.05 in
Shrouding	Unshrouded
Style	Board
Termination	Solder

HMTMS Series

Part	Contact Type	Connector Type	Contact Shape	Overall Contact Length	Fastening Type	Insulation Height	Number of Positions	Contact Finish - Post	Mounting Type	Number of Positions Loaded	Insulation Color	Pitch - Mating	Contact Finish Thickness - Mating	Insulation Material	Operating Temperature (Max)	Operating Temperature (Min)	Number of Rows	Contact Finish - Mating	Contact Length - Mating	Shrouding	Contact Length - Post	Style	Row Spacing - Mating	Termination	Contact Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)	Number of Positions Loaded
Samtec Inc. HMTMS-117-51-G-D-155	Male Pin	Header	Square	0.41 in	Push-Pull	0.1 in	34	Gold	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	2	Gold	0.155 in	Unshrouded	0.155 in	Board	0.1 in	Solder	Phosphor Bronze	Flash	Flash
Samtec Inc. HMTMS-115-25-L-D-125	Male Pin	Header	Square	0.33 in	Push-Pull	0.1 in	30	Tin	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	2	Gold	0.125 in	Unshrouded	0.105 in	Board	0.1 in	Solder	Phosphor Bronze
Samtec Inc. HMTMS-103-57-G-S-263	Male Pin	Header	Square	0.65 in	Push-Pull	0.1 in	3	Gold	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	1	Gold	0.263 in	Unshrouded	0.287 in	Board		Solder	Phosphor Bronze	Flash	Flash
Samtec Inc. HMTMS-102-51-S-S-140	Male Pin	Header	Square	0.41 in	Push-Pull	0.1 in	2	Tin	Through Hole	All	Black	0.05 in	30 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	1	Gold	0.14 in	Unshrouded	0.17 in	Board		Solder	Phosphor Bronze
Samtec Inc. HMTMS-105-02-G-D-100	Male Pin	Header	Square	0.32 in	Push-Pull	0.1 in	10	Gold	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	2	Gold	0.1 in	Unshrouded	0.12 in	Board	0.1 in	Solder	Phosphor Bronze	Flash	Flash
Samtec Inc. HMTMS-102-25-G-S-110	Male Pin	Header	Square	0.33 in	Push-Pull	0.1 in	2	Gold	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	1	Gold	0.11 in	Unshrouded	0.12 in	Board		Solder	Phosphor Bronze
Samtec Inc. HMTMS-150-51-S-D-150	Male Pin	Header	Square	0.41 in	Push-Pull	0.1 in	100	Tin	Through Hole	All	Black	0.05 in	30 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	2	Gold	0.15 in	Unshrouded	0.16 in	Board	0.1 in	Solder	Phosphor Bronze
Samtec Inc. HMTMS-108-01-G-S-230	Male Pin	Header	Square	0.45 in	Push-Pull	0.1 in	8	Gold	Through Hole	All	Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	1	Gold	0.23 in	Unshrouded	0.12 in	Board		Solder	Phosphor Bronze
Samtec Inc. HMTMS-130-54-S-D-335	Male Pin	Header	Square	0.555 in	Push-Pull	0.1 in	60	Tin	Through Hole	All	Black	0.05 in	30 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	2	Gold	0.335 in	Unshrouded	0.12 in	Board	0.1 in	Solder	Phosphor Bronze
Samtec Inc. HMTMS-106-54-G-S-335-002	Male Pin	Header	Square	0.555 in	Push-Pull	0.1 in	6	Gold	Through Hole		Black	0.05 in	10 µin	Liquid Crystal Polymer (LCP)	125 °C	-55 °C	1	Gold	0.335 in	Unshrouded	0.12 in	Board		Solder	Phosphor Bronze			5

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CAD

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Documents

Technical documentation and resources

HMTMS-108-01-G-S-230 Datasheet (PDF)