HMTMS Series
Manufacturer: Samtec Inc.
BOARD TO BOARD & MEZZANINE CONNECTORS .050" X .100" HIGH-TEMP VARIABLE POST HEIGHT MICRO TERMINAL STRIP
| Part | Contact Type | Connector Type | Contact Shape | Overall Contact Length | Fastening Type | Insulation Height | Number of Positions | Contact Finish - Post | Mounting Type | Number of Positions Loaded | Insulation Color | Pitch - Mating | Contact Finish Thickness - Mating | Insulation Material | Operating Temperature (Max) | Operating Temperature (Min) | Number of Rows | Contact Finish - Mating | Contact Length - Mating | Shrouding | Contact Length - Post | Style | Row Spacing - Mating | Termination | Contact Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post (string_set) | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | Header | Square | 0.41 in | Push-Pull | 0.1 in | 34 | Gold | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 2 | Gold | 0.155 in | Unshrouded | 0.155 in | Board | 0.1 in | Solder | Phosphor Bronze | Flash | Flash | |
Samtec Inc. | Male Pin | Header | Square | 0.33 in | Push-Pull | 0.1 in | 30 | Tin | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 2 | Gold | 0.125 in | Unshrouded | 0.105 in | Board | 0.1 in | Solder | Phosphor Bronze | |||
Samtec Inc. | Male Pin | Header | Square | 0.65 in | Push-Pull | 0.1 in | 3 | Gold | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 1 | Gold | 0.263 in | Unshrouded | 0.287 in | Board | Solder | Phosphor Bronze | Flash | Flash | ||
Samtec Inc. | Male Pin | Header | Square | 0.41 in | Push-Pull | 0.1 in | 2 | Tin | Through Hole | All | Black | 0.05 in | 30 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 1 | Gold | 0.14 in | Unshrouded | 0.17 in | Board | Solder | Phosphor Bronze | ||||
Samtec Inc. | Male Pin | Header | Square | 0.32 in | Push-Pull | 0.1 in | 10 | Gold | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 2 | Gold | 0.1 in | Unshrouded | 0.12 in | Board | 0.1 in | Solder | Phosphor Bronze | Flash | Flash | |
Samtec Inc. | Male Pin | Header | Square | 0.33 in | Push-Pull | 0.1 in | 2 | Gold | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 1 | Gold | 0.11 in | Unshrouded | 0.12 in | Board | Solder | Phosphor Bronze | ||||
Samtec Inc. | Male Pin | Header | Square | 0.41 in | Push-Pull | 0.1 in | 100 | Tin | Through Hole | All | Black | 0.05 in | 30 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 2 | Gold | 0.15 in | Unshrouded | 0.16 in | Board | 0.1 in | Solder | Phosphor Bronze | |||
Samtec Inc. | Male Pin | Header | Square | 0.45 in | Push-Pull | 0.1 in | 8 | Gold | Through Hole | All | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 1 | Gold | 0.23 in | Unshrouded | 0.12 in | Board | Solder | Phosphor Bronze | ||||
Samtec Inc. | Male Pin | Header | Square | 0.555 in | Push-Pull | 0.1 in | 60 | Tin | Through Hole | All | Black | 0.05 in | 30 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 2 | Gold | 0.335 in | Unshrouded | 0.12 in | Board | 0.1 in | Solder | Phosphor Bronze | |||
Samtec Inc. | Male Pin | Header | Square | 0.555 in | Push-Pull | 0.1 in | 6 | Gold | Through Hole | Black | 0.05 in | 10 µin | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 1 | Gold | 0.335 in | Unshrouded | 0.12 in | Board | Solder | Phosphor Bronze | 5 |