
PMPB215ENEAX
ActiveNexperia USA Inc.
80 V, SINGLE N-CHANNEL TRENCH MOSFET

PMPB215ENEAX
ActiveNexperia USA Inc.
80 V, SINGLE N-CHANNEL TRENCH MOSFET
Description
General part information
PMPB215ENEA Series
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMPB215ENEAX |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 1.9 A |
| Drain to Source Voltage (Vdss) | 80 V |
| Drive Voltage (Max Rds On) | 4.5 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 7.2 nC, 7.2 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 215 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 6-UDFN Exposed Pad |
| Package Name | DFN2020MD-6 |
| Power Dissipation (Max) | 1.6 W, 15.6 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 230 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.7 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
DFN2020MD-6; Reel pack for SMD, 7''; Q2/T3 product orientation
Failure signature of Electrical Overstress on Power MOSFETs
Using power MOSFETs in parallel
Questions about package outline drawings
Power MOSFET single-shot and repetitive avalanche ruggedness rating
Power MOSFET frequently asked questions and answers
LFPAK MOSFET thermal design guide, Chinese version
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body
Reflow soldering profile
RC Thermal Models
小巧轻便的汽车 二极管和晶体管
Nexperia package poster
Automatic Optical Inspection of DFN Components
Thermal performance of DFN packages
LFPAK MOSFET thermal design guide - Part 2
Small & light automotive diodes and transistors
plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body