
240-1280-29-0602J
Active3M
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
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240-1280-29-0602J
Active3M
IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER
Deep-Dive with AI
Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | 240-1280-29-0602J | 240 Series |
---|---|---|
Contact Finish - Mating | Gold | Gold |
Contact Finish - Post | Gold | Gold |
Contact Finish Thickness - Mating | 30 Áin | 30 Áin |
Contact Finish Thickness - Mating | 0.76 Ám | 0.76 Ám |
Contact Finish Thickness - Post | 30 µin | 30 µin |
Contact Finish Thickness - Post | 0.76 µm | 0.76 - 30 µm |
Contact Finish Thickness - Post | - | 0.76 Ám |
Contact Material - Mating | Beryllium Copper | Beryllium Copper |
Contact Material - Post | Beryllium Copper | Beryllium Copper |
Contact Resistance | - | 15 - 25 mOhm |
Convert From (Adapter End) | 15.24 mm | 15.24 mm |
Convert From (Adapter End) | DIP | DIP |
Convert From (Adapter End) | 0.6 in | 0.6 - 25.4 in |
Convert From (Adapter End) | - | 1 in |
Convert To (Adapter End) | 0.6 in | 0.6 in |
Convert To (Adapter End) | DIP | DIP |
Convert To (Adapter End) | 15.24 mm | 1 - 15.24 mm |
Convert To (Adapter End) | - | 25.4 mm |
Current Rating (Amps) | 1 A | 1 A |
Features | Closed Frame | Closed Frame |
Housing Material | Polysulfone (PSU), Glass Filled | Polyethersulfone (PES), Polysulfone (PSU), Glass Filled |
Material Flammability Rating | UL94 V-0 | UL94 V-0 |
Mounting Type | Through Hole | Through Hole, Connector |
Number of Pins | 40 | 40 |
Number of Positions or Pins (Grid) | - | 10 - 20 |
Number of Positions or Pins (Grid) | - | 40 |
Number of Positions or Pins (Grid) | - | 2 - 4 |
Number of Positions or Pins (Grid) | - | 40 |
Operating Temperature [Max] | 125 °C | 125 °C |
Operating Temperature [Min] | -55 °C | -55 °C |
Pitch - Mating | 0.1 in | 0.1 in |
Pitch - Mating | 2.54 mm | 2.54 mm |
Pitch - Post | 2.54 mm | 2.54 mm |
Pitch - Post | 0.1 in | 0.1 in |
Termination | Solder | Solder, Press-Fit, Wire Wrap |
Termination Post Length | 3.3 mm | 2.78 - 3.3 mm |
Termination Post Length | 0.13 in | 0.11 - 0.13 in |
Termination Post Length | - | 0.62 in |
Termination Post Length | - | 15.75 mm |
Type | - | QFN, DIP, ZIF (ZIP) |
Type | - | 15.24 mm |
Type | - | 0.6 " |
240 Series
IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER
Part | Contact Material - Post | Housing Material | Contact Resistance | Contact Finish - Mating | Features | Mounting Type | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Type | Contact Finish - Post | Contact Material - Mating | Termination | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Type | Type | Material Flammability Rating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] | Convert From (Adapter End) | Convert From (Adapter End) | Convert From (Adapter End) | Number of Pins | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Termination Post Length [x] | Termination Post Length [x] | Convert To (Adapter End) | Convert From (Adapter End) | Contact Finish Thickness - Post |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Beryllium Copper | Polyethersulfone (PES) | 25 mOhm | Gold | Closed Frame | Through Hole | 10 | 40 | 4 | QFN | Gold | Beryllium Copper | Solder | 0.118 in | 3 mm | ||||||||||||||||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | 15 mOhm | Gold | Closed Frame | Connector | 20 | 2 | DIP, ZIF (ZIP) | Gold | Beryllium Copper | Press-Fit | 0.11 in | 2.78 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | 15.24 mm | 0.6 " | UL94 V-0 | 40 | 1 A | -55 °C | 125 °C | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Wire Wrap | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | DIP | 25.4 mm | 40 | DIP | 1 " | 0.62 in | 15.75 mm | 25.4 mm | 1 in | ||||||||||||||
Beryllium Copper | Polyethersulfone (PES) | 25 mOhm | Gold | Closed Frame | Through Hole | 10 | 40 | 4 | QFN | Gold | Beryllium Copper | Solder | 0.118 in | 3 mm | ||||||||||||||||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | |||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Solder | 0.13 in | 3.3 mm | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 Áin | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | DIP | 25.4 mm | 40 | DIP | 1 " | 25.4 mm | 1 in | 0.76 Ám | ||||||||||||||
Beryllium Copper | Polysulfone (PSU), Glass Filled | Gold | Closed Frame | Through Hole | Gold | Beryllium Copper | Wire Wrap | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | 30 µin | 0.76 µm | 2.54 mm | 0.1 in | UL94 V-0 | 1 A | -55 °C | 125 °C | 15.24 mm | DIP | 0.6 in | 40 | 0.6 in | DIP | 15.24 mm | 0.62 in | 15.75 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
240 Series
IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole
Documents
Technical documentation and resources