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M4FR5969SRGZT-MLS - VQFN (RGZ)

M4FR5969SRGZT-MLS

Active
Texas Instruments

RADIATION HARDENED MIXED-SIGNAL MICROCONTROLLER

M4FR5969SRGZT-MLS - VQFN (RGZ)

M4FR5969SRGZT-MLS

Active
Texas Instruments

RADIATION HARDENED MIXED-SIGNAL MICROCONTROLLER

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationM4FR5969SRGZT-MLSMSP430FR5969-SP Series
Connectivity-SCI, I2C, LINbus, SPI, UART/USART, IrDA
Core Processor-CPUXV2
Core Size-16-Bit
Data Converters-16
Data Converters-12 b
Mounting Type-Surface Mount
null-
Number of I/O-40
Operating Temperature--55 °C
Operating Temperature-105 °C
Oscillator Type-Internal
Package / Case-48-PowerTQFP
Peripherals-Brown-out Detect/Reset, DMA, POR, WDT, PWM
Program Memory Size-64 KB
Program Memory Type-FRAM
RAM Size-2K x 8
Speed-16 MHz
Supplier Device Package-48-HTQFP (7x7)
Voltage - Supply (Vcc/Vdd)-1.8 V
Voltage - Supply (Vcc/Vdd)-3.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Texas InstrumentsSMALL T&R 1$ 3277.57
10$ 3101.98
100$ 2926.40

MSP430FR5969-SP Series

Radiation Hardened Mixed-Signal Microcontroller

PartProgram Memory TypeSupplier Device PackageCore ProcessorOperating Temperature [Min]Operating Temperature [Max]Program Memory SizeOscillator TypeData Converters [custom]Data Converters [custom]Core SizePeripheralsNumber of I/OConnectivityMounting TypeVoltage - Supply (Vcc/Vdd) [Min]Voltage - Supply (Vcc/Vdd) [Max]SpeedPackage / CaseRAM Size
Texas Instruments
M4FR5969SPHPT-MLS
Texas Instruments
M4FR5969SPHPT-MLS
FRAM
48-HTQFP (7x7)
CPUXV2
-55 °C
105 °C
64 KB
Internal
16
12 b
16-Bit
Brown-out Detect/Reset, DMA, POR, PWM, WDT
40
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Surface Mount
1.8 V
3.6 V
16 MHz
48-PowerTQFP
2K x 8
Texas Instruments
M4FR5969SRGZT-MLS
Texas Instruments
M4FR5969SRGZT-MLS

Description

General part information

MSP430FR5969-SP Series

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The ultra low-power architecture of the MSP430FR5969-SP showcases seven low-power modes, optimized to achieve power efficient distributed telemetry/housekeeping systems.

The integrated mixed-signal features of the MSP430FR5969-SP make it ideally suited for distributed telemetry applications in next-generation spacecraft. The strong immunity to single-event latchup and total ionizing dose, enable the device to be used in a variety of space and radiation environments.

Documents

Technical documentation and resources

Satellite state of health: how space-grade ICs are improving telemetry circuit des

Technical article

Radiation-Hardened Space Battery Management System (BMS) Reference Design

Design guide

ESD Diode Current Specification (Rev. B)

Application note

MSP430FR5969-SP Radiation Hardened Mixed-Signal Microcontroller datasheet (Rev. A)

Data sheet

Software I2C on MSP430 MCUs (Rev. A)

Application note

MSP430 FRAM Technology – How To and Best Practices (Rev. B)

Application note

General Oversampling of MSP ADCs for Higher Resolution (Rev. A)

Application note

DLA Approved Optimizations for QML Products (Rev. B)

Application brief

Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A)

Application note

TSW12D1620EVM-CVAL User's Guide (Rev. A)

User guide

MSP430 System-Level ESD Considerations (Rev. B)

Application note

MSP430FR5969 LaunchPad Development Kit (MSP-EXP430FR5969) User's Guide (Rev. B)

User guide

Single-Event Effects Confidence Interval Calculations (Rev. A)

Application note

MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)

User guide

TI Space Products (Rev. K)

Selection guide

MSP430FRBoot – Main Memory Bootloader and Over-the-Air Updates for MSP430 FRAM (Rev. E)

Application note

MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)

User guide

Single-event Effects Test Report of the MSP430FR5969-SP

Radiation & reliability report

MSP430 System ESD Troubleshooting Guide

Application note

MSP430 MCUs Development Guide Book (Rev. A)

User guide

MSP430FR5969-SP Neutron Displacement Damage Characterization Radiation Report

Radiation & reliability report

Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)

Application note

MSP Code Protection Features

Application note

Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs

User guide

TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. B)

More literature

Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers

Application note

MSP430FR5969 Microcontroller Errata (Rev. AG)

Errata

MSP430FR5969-SP Radiation-Hardened Mixed-Signal Microcontroller TID Rad Report

Radiation & reliability report

Datasheet

Datasheet