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100-014-001

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3M

CONN IC DIP SOCKET 14POS GOLD

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100-014-001

Active
3M

CONN IC DIP SOCKET 14POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification100-014-001100-014 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating0.203 Ám0.203 Ám
Contact Finish Thickness - Mating8 Áin8 Áin
Contact Finish Thickness - PostFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Current Rating (Amps)1 A1 A
FeaturesSeal Tape, Closed FrameSeal Tape, Closed Frame, Open Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass FilledPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole
Number of Positions or Pins (Grid)1414
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-65 ░C-65 ░C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.2 mm3.2 mm
Termination Post Length0.126 in0.126 in
Type0.3 "0.3 "
Type7.62 mm7.62 mm
TypeDIPDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

100-014 Series

CONN IC DIP SOCKET 14POS GOLD

PartContact Material - Post [custom]FeaturesNumber of Positions or Pins (Grid)Mounting TypeMaterial Flammability RatingContact Material - MatingPitch - MatingPitch - MatingTermination Post LengthTermination Post LengthHousing MaterialContact Finish - MatingOperating Temperature [Max]Operating Temperature [Min]TerminationContact Finish Thickness - PostContact Finish - PostPitch - PostPitch - PostTypeTypeTypeContact Finish Thickness - MatingContact Finish Thickness - MatingCurrent Rating (Amps)
Brass
Closed Frame, Seal Tape
14
Through Hole
UL94 V-0
Beryllium Copper
0.1 in
2.54 mm
3.2 mm
0.126 in
Polyphenylene Sulfide (PPS), Glass Filled
Gold
125 °C
-65 ░C
Solder
Flash
Gold
2.54 mm
0.1 in
0.3 "
7.62 mm
DIP
0.203 Ám
8 Áin
1 A
Brass
Open Frame
14
Through Hole
UL94 V-0
Beryllium Copper
0.1 in
2.54 mm
3.2 mm
0.126 in
Polyphenylene Sulfide (PPS), Glass Filled
Gold
125 °C
-65 ░C
Solder
Flash
Gold
2.54 mm
0.1 in
0.3 "
7.62 mm
DIP
0.203 Ám
8 Áin
1 A
Brass
Open Frame
14
Through Hole
UL94 V-0
Beryllium Copper
0.1 in
2.54 mm
3.2 mm
0.126 in
Polyphenylene Sulfide (PPS), Glass Filled
Gold
125 °C
-65 ░C
Solder
Flash
Gold
2.54 mm
0.1 in
0.3 "
7.62 mm
DIP
0.203 Ám
8 Áin
1 A

Description

General part information

100-014 Series

14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available