CONN IC DIP SOCKET 14POS GOLD
| Part | Contact Material - Post [custom] | Features | Number of Positions or Pins (Grid) | Mounting Type | Material Flammability Rating | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Housing Material | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Contact Finish Thickness - Post | Contact Finish - Post | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Brass | Closed Frame, Seal Tape | 14 | Through Hole | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm | 3.2 mm | 0.126 in | Polyphenylene Sulfide (PPS), Glass Filled | Gold | 125 °C | -65 ░C | Solder | Flash | Gold | 2.54 mm | 0.1 in | 0.3 " | 7.62 mm | DIP | 0.203 Ám | 8 Áin | 1 A | |
Brass | Open Frame | 14 | Through Hole | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm | 3.2 mm | 0.126 in | Polyphenylene Sulfide (PPS), Glass Filled | Gold | 125 °C | -65 ░C | Solder | Flash | Gold | 2.54 mm | 0.1 in | 0.3 " | 7.62 mm | DIP | 0.203 Ám | 8 Áin | 1 A | |
Brass | Open Frame | 14 | Through Hole | UL94 V-0 | Beryllium Copper | 0.1 in | 2.54 mm | 3.2 mm | 0.126 in | Polyphenylene Sulfide (PPS), Glass Filled | Gold | 125 °C | -65 ░C | Solder | Flash | Gold | 2.54 mm | 0.1 in | 0.3 " | 7.62 mm | DIP | 0.203 Ám | 8 Áin | 1 A |