Specification	14-810-90RWR

Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Current Rating	1 A
Features	Closed Frame
Grid Columns	7
Grid Rows	2
Housing Material	PA46, Polyamide, Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Vertical, Right Angle, Through Hole
Number of Positions or Pins (Grid)	14
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Termination Post Length	0.15 in
Type	DIP, 0.3" (7.62mm) Row Spacing

14-810 Series

Part	Material Flammability Rating	Current Rating	Termination Post Length	Features	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Termination	Contact Material - Mating	Contact Finish - Mating	Mounting Type	Contact Material - Post	Housing Material	Row Spacing	Type	Contact Finish Thickness - Post	Pitch - Mating	Contact Finish - Post	Pitch - Post	Contact Finish Thickness - Mating	Operating Temperature (Min)	Operating Temperature (Max)
Aries Electronics 14-81010-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-810-90R	UL94 V-0	1 A	0.15 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	50 µin	0.1 in	Tin	0.1 in	50 µin
Aries Electronics 14-810-90RWR	UL94 V-0	1 A	0.15 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	50 µin	0.1 in	Tin	0.1 in	50 µin
Aries Electronics 14-81000-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-81000-10WR	UL94 V-0	1 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Phosphor Bronze	Tin	Through Hole	Phosphor Bronze	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	200 Ąin	-55 °C	105 °C
Aries Electronics 14-810-90C	UL94 V-0	3 A	0.14 in	Closed Frame	14	7	2	Solder	Beryllium Copper	Gold	Right Angle Through Hole Vertical	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	30 µin
Aries Electronics 14-81040-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-810-90WR	UL94 V-0	1.5 A	0.145 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Gold	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	10 µin
Aries Electronics 14-810-90T	UL94 V-0	1.5 A	0.145 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	200 Ąin
Aries Electronics 14-81000-610C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C

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14-810-90RWR | Datasheet