14-810 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Features	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Termination	Contact Material - Mating	Contact Finish - Mating	Mounting Type	Contact Material - Post	Housing Material	Row Spacing	Type	Contact Finish Thickness - Post	Pitch - Mating	Contact Finish - Post	Pitch - Post	Contact Finish Thickness - Mating	Operating Temperature (Min)	Operating Temperature (Max)
Aries Electronics 14-81010-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-810-90R	UL94 V-0	1 A	0.15 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	50 µin	0.1 in	Tin	0.1 in	50 µin
Aries Electronics 14-810-90RWR	UL94 V-0	1 A	0.15 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	50 µin	0.1 in	Tin	0.1 in	50 µin
Aries Electronics 14-81000-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-81000-10WR	UL94 V-0	1 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Phosphor Bronze	Tin	Through Hole	Phosphor Bronze	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	200 Ąin	-55 °C	105 °C
Aries Electronics 14-810-90C	UL94 V-0	3 A	0.14 in	Closed Frame	14	7	2	Solder	Beryllium Copper	Gold	Right Angle Through Hole Vertical	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	30 µin
Aries Electronics 14-81040-310C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C
Aries Electronics 14-810-90WR	UL94 V-0	1.5 A	0.145 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Gold	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	10 µin
Aries Electronics 14-810-90T	UL94 V-0	1.5 A	0.145 in	Closed Frame	14	7	2	Solder	Phosphor Bronze	Tin	Right Angle Through Hole Vertical	Phosphor Bronze	Nylon 4/6 PA46 Polyamide	0.3 in	0.3" (7.62mm) Row Spacing DIP	200 µin	0.1 in	Tin	0.1 in	200 Ąin
Aries Electronics 14-81000-610C	UL94 V-0	3 A	0.14 in	Closed Frame Elevated	14	7	2	Solder	Beryllium Copper	Gold	Through Hole	Brass	Glass Filled Nylon 4/6 PA46 Polyamide	0.6 in	0.6" (15.24mm) Row Spacing DIP	10 µin	0.1 in	Gold	0.1 in	30 µin	-55 °C	105 °C