
658-35AB
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BALL GRID ARRAY, BLACK ANODIZED, BGA, 27.9 MM, 8.89 MM, 28 MM

658-35AB
ActiveWakefield Thermal Solutions
HEAT SINK, FOR BALL GRID ARRAY, BLACK ANODIZED, BGA, 27.9 MM, 8.89 MM, 28 MM
Description
General part information
658-35 Series
Heat Sink BGA Aluminum Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | 658-35AB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height | 0.35 in |
| Length | 1.1 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | BGA |
| Shape | Square, Pin Fins |
| Thermal Resistance | 3 °C/W |
| Type | Top Mount |
| Width | 1.1 in |
Pricing
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CAD
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Documents
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