658-35 Series
Manufacturer: Wakefield Thermal Solutions
HEAT SINK, SQUARE, FOR BALL GRID ARRAYS, PENGUIN COOLER, PIN FIN, BGA, 27.9 MM, 8.89 MM, 28 MM
| Part | Type | Material | Material Finish | Width | Attachment Method | Length | Fin Height | Package Cooled | Thermal Resistance | Shape |
|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Top Mount | Aluminum | Black Anodized | 1.1 in | Adhesive (Included) Thermal Tape | 1.1 in | 0.35 in | BGA | 3 °C/W | Pin Fins Square |
Wakefield Thermal Solutions | Top Mount | Aluminum | Black Anodized | 1.1 in | Adhesive (Included) Thermal Tape | 1.1 in | 0.35 in | BGA | 3 °C/W | Pin Fins Square |
Wakefield Thermal Solutions | Top Mount | Aluminum | Black Anodized | 1.1 in | Adhesive (Not Included) Thermal Tape | 1.1 in | 0.35 in | BGA | 3 °C/W | Pin Fins Square |
Wakefield Thermal Solutions | Top Mount | Aluminum | Black Anodized | 1.1 in | Adhesive (Not Included) Thermal Tape | 1.1 in | 0.35 in | BGA | 3 °C/W | Pin Fins Square |