Specification	144-PGM15025-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Current Rating	3 A
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.165 in
Type	PGA

144-PGM Series

Part	Current Rating	Material Flammability Rating	Termination Post Length	Pitch - Mating	Contact Finish Thickness - Mating	Termination	Operating Temperature (Min)	Operating Temperature (Max)	Contact Material - Mating	Contact Finish Thickness - Post	Type	Mounting Type	Contact Finish - Post	Contact Finish - Mating	Pitch - Post	Contact Material - Post	Housing Material
Aries Electronics 144-PGM13095-10	3 A	UL94 V-0	0.165 in	0.1 in	10 µin	Solder	-55 °C	105 °C	Beryllium Copper	200 µin	PGA	Through Hole	Tin	Gold	0.1 in	Brass	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 144-PGM12001-41	3 A	UL94 V-0	0.165 in	0.1 in	10 µin	Solder	-55 °C	125 °C	Beryllium Copper	10 µin	PGA	Through Hole	Gold	Gold	0.1 in	Brass	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 144-PGM12001-51	3 A	UL94 V-0	0.165 in	0.1 in	10 µin	Solder	-55 °C	125 °C	Beryllium Copper	10 µin	PGA	Through Hole	Gold	Gold	0.1 in	Brass	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 144-PGM13095-11	3 A	UL94 V-0	0.165 in	0.1 in	10 µin	Solder	-55 °C	125 °C	Beryllium Copper	10 µin	PGA	Through Hole	Gold	Gold	0.1 in	Brass	Glass Filled Nylon 4/6 PA46 Polyamide
Aries Electronics 144-PGM15025-10	3 A	UL94 V-0	0.165 in	0.1 in	10 µin	Solder	-55 °C	105 °C	Beryllium Copper	200 µin	PGA	Through Hole	Tin	Gold	0.1 in	Brass	Glass Filled Nylon 4/6 PA46 Polyamide

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