144-PGM Series
Manufacturer: Aries Electronics
CONN SOCKET PGA GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Pitch - Mating | Contact Finish Thickness - Mating | Termination | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Mating | Contact Finish Thickness - Post | Type | Mounting Type | Contact Finish - Post | Contact Finish - Mating | Pitch - Post | Contact Material - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.165 in | 0.1 in | 10 µin | Solder | -55 °C | 105 °C | Beryllium Copper | 200 µin | PGA | Through Hole | Tin | Gold | 0.1 in | Brass | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 3 A | UL94 V-0 | 0.165 in | 0.1 in | 10 µin | Solder | -55 °C | 125 °C | Beryllium Copper | 10 µin | PGA | Through Hole | Gold | Gold | 0.1 in | Brass | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 3 A | UL94 V-0 | 0.165 in | 0.1 in | 10 µin | Solder | -55 °C | 125 °C | Beryllium Copper | 10 µin | PGA | Through Hole | Gold | Gold | 0.1 in | Brass | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 3 A | UL94 V-0 | 0.165 in | 0.1 in | 10 µin | Solder | -55 °C | 125 °C | Beryllium Copper | 10 µin | PGA | Through Hole | Gold | Gold | 0.1 in | Brass | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | 3 A | UL94 V-0 | 0.165 in | 0.1 in | 10 µin | Solder | -55 °C | 105 °C | Beryllium Copper | 200 µin | PGA | Through Hole | Tin | Gold | 0.1 in | Brass | Glass Filled Nylon 4/6 PA46 Polyamide |