Specification	228-5204-01

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Grid Columns	7
Grid Rows	4
Housing Material	PES, Polyethersulfone
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.02 in
Termination	Solder
Termination Post Length	0.118 in
Type	QFN

228 Series

Part	Number of Pins	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Contact Finish - Post	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Contact Finish - Mating	Pitch - Post	Termination	Pitch - Mating	Housing Material	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Material Flammability Rating	Termination Post Length	Contact Material - Post	Contact Finish Thickness - Post	Current Rating	Contact Material - Mating	Convert To (Adapter End)	Convert To (Adapter End) Row Spacing	Features	Type	Row Spacing	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Resistance
3M Electronic Specialty 228-1277-09-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper
3M Electronic Specialty 228-1277-19-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0		Beryllium Copper	30 µin	1 A	Beryllium Copper
3M Electronic Specialty 228-1290-09-0602J	28 pins	DIP	DIP Row Spacing	0.4 "	Gold	0.4 in	Row Spacing	Gold	0.07 in	Solder	0.07 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper	DIP	0.4 in
3M Electronic Specialty 228-4817-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.1 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.4" (10.16mm) Row Spacing DIP ZIF (ZIP)	0.4 in	14	28	2	15 mOhm
3M Electronic Specialty 228-7474-55-1902					Gold			Gold		Solder		Glass Filled PES Polyethersulfone	Through Hole	150 °C	-55 °C		UL94 V-0	0.14 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	SOIC		14	28	2
3M Electronic Specialty 228-5204-01					Gold			Gold		Solder	0.02 in	PES Polyethersulfone	Through Hole					0.118 in	Beryllium Copper			Beryllium Copper				QFN		7	28	4	25 mOhm
3M Electronic Specialty 228-1290-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.07 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.6 in	14	28	2	15 mOhm
3M Electronic Specialty 228-1371-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.1 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.6 in	14	28	2	15 mOhm
3M Electronic Specialty 228-4817-09-0602J	28 pins	DIP	DIP Row Spacing	0.4 "	Gold	0.4 in	Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper	DIP	0.4 in
3M Electronic Specialty 228-1277-39-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0		Beryllium Copper	30 µin	1 A	Beryllium Copper

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Datasheet

228-5204-01 | Datasheet