228-1371-00-0602J

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3M Electronic Specialty

IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER

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228-1371-00-0602J

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3M Electronic Specialty

IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER

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Description Specifications Series Pricing CAD Documents

Description

General part information

228 Series

The 228-1371-00-0602J is a 28-way Textool™ Universal DIP Socket with gold-plated beryllium copper contacts, 2.54mm lead spacing. This socket is glass filled polysulfone insulated, lever actuated zero insertion force mechanism, extra wide contact zone allows insertion of DIP's with distance between rows from 7.62mm through 15.24mm.

Technical Specifications

Parameters and characteristics for this part

Specification	228-1371-00-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	15 mOhm
Current Rating	1 A
Features	Closed Frame
Grid Columns	14
Grid Rows	2
Housing Material	Polysulfone, PSU, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Connector
Number of Positions or Pins (Grid)	28
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.6 in
Termination	Press-Fit
Termination Post Length	0.11 in
Type	ZIF (ZIP), DIP, 0.6" (15.24mm) Row Spacing

228 Series

Part	Number of Pins	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Contact Finish - Post	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Contact Finish - Mating	Pitch - Post	Termination	Pitch - Mating	Housing Material	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Material Flammability Rating	Termination Post Length	Contact Material - Post	Contact Finish Thickness - Post	Current Rating	Contact Material - Mating	Convert To (Adapter End)	Convert To (Adapter End) Row Spacing	Features	Type	Row Spacing	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Resistance
3M Electronic Specialty 228-1277-09-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper
3M Electronic Specialty 228-1277-19-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0		Beryllium Copper	30 µin	1 A	Beryllium Copper
3M Electronic Specialty 228-1290-09-0602J	28 pins	DIP	DIP Row Spacing	0.4 "	Gold	0.4 in	Row Spacing	Gold	0.07 in	Solder	0.07 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper	DIP	0.4 in
3M Electronic Specialty 228-4817-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.1 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.4" (10.16mm) Row Spacing DIP ZIF (ZIP)	0.4 in	14	28	2	15 mOhm
3M Electronic Specialty 228-7474-55-1902					Gold			Gold		Solder		Glass Filled PES Polyethersulfone	Through Hole	150 °C	-55 °C		UL94 V-0	0.14 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	SOIC		14	28	2
3M Electronic Specialty 228-5204-01					Gold			Gold		Solder	0.02 in	PES Polyethersulfone	Through Hole					0.118 in	Beryllium Copper			Beryllium Copper				QFN		7	28	4	25 mOhm
3M Electronic Specialty 228-1290-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.07 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.6 in	14	28	2	15 mOhm
3M Electronic Specialty 228-1371-00-0602J					Gold			Gold	0.1 in	Press-Fit	0.1 in	Glass Filled Polysulfone PSU	Connector	125 °C	-55 °C	30 µin	UL94 V-0	0.11 in	Beryllium Copper	30 µin	1 A	Beryllium Copper			Closed Frame	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	0.6 in	14	28	2	15 mOhm
3M Electronic Specialty 228-4817-09-0602J	28 pins	DIP	DIP Row Spacing	0.4 "	Gold	0.4 in	Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0	0.13 in	Beryllium Copper	30 µin	1 A	Beryllium Copper	DIP	0.4 in
3M Electronic Specialty 228-1277-39-0602J	28 pins	DIP	DIP Row Spacing	0.6 "	Gold	0.6 in	DIP Row Spacing	Gold	0.1 in	Solder	0.1 in	Glass Filled Polysulfone PSU	Through Hole	125 °C	-55 °C	30 µin	UL94 V-0		Beryllium Copper	30 µin	1 A	Beryllium Copper

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

228-1371-00-0602J | Datasheet