WS991 Series

Part	Shelf Life Start	Flux Type	Mesh Type	Melting Point	Type	Form Weight	Form	Ag Composition	Composition Elements	Composition Formula	Bi Composition	Sn Composition	Shelf Life	Process	Cu Composition	Composition
Chip Quik Inc. WS991LT500T4	Date of Manufacture	Water Soluble	4	281 °F	Solder Paste	17.64 oz	Jar	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %	6 Months	Lead Free
Chip Quik Inc. WS991SNL500T4	Date of Manufacture	Water Soluble	4	423 °F	Solder Paste	17.64 oz	Jar	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5		96.5 %	6 Months	Lead Free	0.5 %
Chip Quik Inc. WS991AX500T4	Date of Manufacture	Water Soluble	4	361 °F	Solder Paste	17.64 oz	Jar						6 Months	Leaded		Pb37 Sn63

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