WS991SNL500T4
ActiveChip Quik Inc.
SOLDER PASTE THERMALLY STABLE WS
WS991SNL500T4
ActiveChip Quik Inc.
SOLDER PASTE THERMALLY STABLE WS
Description
General part information
WS991 Series
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Technical Specifications
Parameters and characteristics for this part
| Specification | WS991SNL500T4 |
|---|---|
| Ag Composition | 3 % |
| Composition Elements | Cu, Sn, Ag |
| Composition Formula | Sn96.5Ag3Cu0.5 |
| Cu Composition | 0.5 % |
| Flux Type | Water Soluble |
| Form | Jar |
| Form Weight | 17.64 oz |
| Melting Point | 423 °F |
| Mesh Type | 4 |
| Process | Lead Free |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Sn Composition | 96.5 % |
| Type | Solder Paste |
Pricing
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