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S25FL512SAGBHIA13 - INFINEON S25FL128SAGBHBA03

S25FL512SAGBHIA13

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Infineon Technologies

FLASH MEMORY, SERIAL NOR, 512 MBIT, 64M X 8BIT, SPI, BGA, 24 PINS

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S25FL512SAGBHIA13 - INFINEON S25FL128SAGBHBA03

S25FL512SAGBHIA13

Active
Infineon Technologies

FLASH MEMORY, SERIAL NOR, 512 MBIT, 64M X 8BIT, SPI, BGA, 24 PINS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationS25FL512SAGBHIA13
Clock Frequency133 MHz
Memory FormatFLASH
Memory InterfaceSPI - Quad I/O
Memory Organization64 M
Memory Size64 MB
Memory TypeNon-Volatile
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case24-TBGA
Supplier Device Package24-BGA
TechnologyFLASH - NOR
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.28
10$ 5.85
25$ 5.67
50$ 5.54
100$ 5.40
250$ 5.23
500$ 5.14
Digi-Reel® 1$ 6.28
10$ 5.85
25$ 5.67
50$ 5.54
100$ 5.40
250$ 5.23
500$ 5.14
Tape & Reel (TR) 2500$ 4.94
NewarkEach (Supplied on Cut Tape) 1$ 10.50
10$ 9.32
25$ 8.89
50$ 8.57
100$ 8.27
250$ 7.88
500$ 7.60
1000$ 7.33

Description

General part information

S25FL512 Series

S25FL512SAGBHIA13 is a S25FL series 3V, FL-S serial peripheral interface (SPI) flash memory IC using MIRRORBIT™ technology - that stores two data bits in each memory array transistor, eclipse architecture - that dramatically improves program and erase performance and 65-nm process lithography. In addition, the FL-S family adds support for double data rate (DDR) read commands for SIO, DIO, and QIO that transfer address and read data on both edges of the clock. The eclipse architecture features a page programming buffer that allows up to 256 words (512 bytes) to be programmed in one operation, resulting in faster effective programming and erase than prior generation SPI program or erase algorithms. It offers high densities coupled with the flexibility and fast performance required by a variety of embedded applications. It is ideal for code shadowing, XIP, and data storage.

Documents

Technical documentation and resources