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MSP430FR69721IRGCT

MSP430FR69721IRGCT

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR69721IRGCT

MSP430FR69721IRGCT

Active
Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR69721 Series

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR69721IRGCT
A/D Channels8 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O51
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case64-VFQFN Exposed Pad
Package Length9 mm
Package Name64-VQFN
Package Width9 mm
PeripheralsLCD, DMA, PWM, POR, Reset, WDT, Brown-out Detect
Program Memory Depth64 K
Program Memory Size64 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430FR58,59,68,69xx User Guide
Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
MSP430FR69721 Device Erratasheet (Rev. S)
ESD Diode Current Specification (Rev. B)
Designing With MSP430™ MCUs and Segment LCDs (Rev. A)
MSP430FR697x(1), MSP430FR687x(1), MSP430FR692x(1), MSP430FR682x(1) Mixed‑Signal Microcontrollers datasheet (Rev. E)
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
MSP Code Protection Features
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
Capacitive Touch and MSP Microcontrollers (Rev. A)
MSP430 MCUs Development Guide Book (Rev. A)
MSP430 System ESD Troubleshooting Guide
Secure In-Field Firmware Updates for MSP MCUs
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
MSP430 FRAM Quality and Reliability (Rev. A)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
MSP430 System-Level ESD Considerations (Rev. B)
System advantages of mixed signal integration
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
FRAM FAQs
Benchmarking MCU power consumption for ultra-low-power applications