Zenode.ai Logo
Beta
K

29-0518-11

Active
Aries Electronics

CONN SOCKET SIP 29POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

29-0518-11

Active
Aries Electronics

CONN SOCKET SIP 29POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification29-0518-11
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)29
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeSIP

29-0518 Series

PartContact Finish - PostTerminationContact Finish Thickness - PostContact Finish Thickness - PostContact Material - MatingTypeMaterial Flammability RatingTermination Post Length [x]Termination Post Length [x]FeaturesContact Finish Thickness - MatingContact Finish Thickness - MatingMounting TypeContact Finish - MatingContact Material - Post [custom]Number of Positions or Pins (Grid)Housing MaterialPitch - MatingPitch - MatingPitch - PostPitch - PostCurrent Rating (Amps)Termination Post LengthTermination Post Length
Aries Electronics
Tin
Solder
200 µin
5.08 µm
Beryllium Copper
SIP
UL94 V-0
0.046 in
1.17 mm
Open Frame
10 çin
0.25 çm
Surface Mount
Gold
Brass
29
Glass Filled
Nylon 4/6
Polyamide (PA46)
0.1 in
2.54 mm
2.54 mm
0.1 in
3 A
Aries Electronics
Tin
Solder
200 µin
5.08 µm
Beryllium Copper
SIP
UL94 V-0
Open Frame
10 çin
0.25 çm
Through Hole
Gold
Brass
29
Glass Filled
Nylon 4/6
Polyamide (PA46)
0.1 in
2.54 mm
2.54 mm
0.1 in
3 A
3.18 mm
0.125 in
Aries Electronics
Gold
Solder
10 çin
0.25 çm
Beryllium Copper
SIP
UL94 V-0
Open Frame
10 çin
0.25 çm
Through Hole
Gold
Brass
29
Glass Filled
Nylon 4/6
Polyamide (PA46)
0.1 in
2.54 mm
2.54 mm
0.1 in
3 A
3.18 mm
0.125 in
Aries Electronics
Tin
Solder
200 µin
5.08 µm
Beryllium Copper
SIP
UL94 V-0
Open Frame
10 çin
0.25 çm
Through Hole
Gold
Brass
29
Glass Filled
Nylon 4/6
Polyamide (PA46)
0.1 in
2.54 mm
2.54 mm
0.1 in
3 A
3.18 mm
0.125 in
Aries Electronics
Gold
Solder
10 çin
0.25 çm
Beryllium Copper
SIP
UL94 V-0
Open Frame
10 çin
0.25 çm
Through Hole
Gold
Brass
29
Glass Filled
Nylon 4/6
Polyamide (PA46)
0.1 in
2.54 mm
2.54 mm
0.1 in
3 A
3.18 mm
0.125 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 130$ 3.90

Description

General part information

29-0518 Series

29 (1 x 29) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources