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240-5205-01 - Textool

240-5205-01

Active
3M

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

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240-5205-01 - Textool

240-5205-01

Active
3M

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification240-5205-01240 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating-30 Áin
Contact Finish Thickness - Mating-0.76 Ám
Contact Finish Thickness - Post-30 µin
Contact Finish Thickness - Post-0.76 - 30 µm
Contact Finish Thickness - Post-0.76 Ám
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - PostBeryllium CopperBeryllium Copper
Contact Resistance25 mOhm15 - 25 mOhm
Convert From (Adapter End)-15.24 mm
Convert From (Adapter End)-DIP
Convert From (Adapter End)-0.6 - 25.4 in
Convert From (Adapter End)-1 in
Convert To (Adapter End)-0.6 in
Convert To (Adapter End)-DIP
Convert To (Adapter End)-1 - 15.24 mm
Convert To (Adapter End)-25.4 mm
Current Rating (Amps)-1 A
FeaturesClosed FrameClosed Frame
Housing MaterialPolyethersulfone (PES)Polyethersulfone (PES), Polysulfone (PSU), Glass Filled
Material Flammability Rating-UL94 V-0
Mounting TypeThrough HoleThrough Hole, Connector
Number of Pins-40
Number of Positions or Pins (Grid)-40
Number of Positions or Pins (Grid) [custom]1010 - 20
Number of Positions or Pins (Grid) [custom]4040
Number of Positions or Pins (Grid) [custom]42 - 4
Operating Temperature--55 °C
Operating Temperature-125 °C
Pitch - Mating-0.1 in
Pitch - Mating-2.54 mm
Pitch - Post-2.54 mm
Pitch - Post-0.1 in
TerminationSolderSolder, Press-Fit, Wire Wrap
Termination Post Length0.118 in0.11 - 0.13 in
Termination Post Length3 mm2.78 - 3.3 mm
Termination Post Length-0.62 in
Termination Post Length-15.75 mm
TypeQFNQFN, DIP, ZIF (ZIP)
Type-15.24 mm
Type-0.6 "

240 Series

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

PartContact Material - PostHousing MaterialContact ResistanceContact Finish - MatingFeaturesMounting TypeNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]TypeContact Finish - PostContact Material - MatingTerminationTermination Post LengthTermination Post LengthContact Finish Thickness - MatingContact Finish Thickness - MatingPitch - MatingPitch - MatingContact Finish Thickness - PostContact Finish Thickness - PostPitch - PostPitch - PostTypeTypeMaterial Flammability RatingNumber of Positions or Pins (Grid)Current Rating (Amps)Operating Temperature [Min]Operating Temperature [Max]Convert From (Adapter End)Convert From (Adapter End)Convert From (Adapter End)Number of PinsConvert To (Adapter End)Convert To (Adapter End)Convert To (Adapter End)Termination Post Length [x]Termination Post Length [x]Convert To (Adapter End)Convert From (Adapter End)Contact Finish Thickness - Post
Beryllium Copper
Polyethersulfone (PES)
25 mOhm
Gold
Closed Frame
Through Hole
10
40
4
QFN
Gold
Beryllium Copper
Solder
0.118 in
3 mm
Beryllium Copper
Polysulfone (PSU), Glass Filled
15 mOhm
Gold
Closed Frame
Connector
20
2
DIP, ZIF (ZIP)
Gold
Beryllium Copper
Press-Fit
0.11 in
2.78 mm
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 µin
0.76 µm
2.54 mm
0.1 in
15.24 mm
0.6 "
UL94 V-0
40
1 A
-55 °C
125 °C
Beryllium Copper
Polysulfone (PSU), Glass Filled
Gold
Closed Frame
Through Hole
Gold
Beryllium Copper
Solder
0.13 in
3.3 mm
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 µin
0.76 µm
2.54 mm
0.1 in
UL94 V-0
1 A
-55 °C
125 °C
15.24 mm
DIP
0.6 in
40
0.6 in
DIP
15.24 mm
Beryllium Copper
Polysulfone (PSU), Glass Filled
Gold
Closed Frame
Through Hole
Gold
Beryllium Copper
Wire Wrap
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 µin
0.76 µm
2.54 mm
0.1 in
UL94 V-0
1 A
-55 °C
125 °C
DIP
25.4 mm
40
DIP
1 "
0.62 in
15.75 mm
25.4 mm
1 in
Beryllium Copper
Polyethersulfone (PES)
25 mOhm
Gold
Closed Frame
Through Hole
10
40
4
QFN
Gold
Beryllium Copper
Solder
0.118 in
3 mm
Beryllium Copper
Polysulfone (PSU), Glass Filled
Gold
Through Hole
Gold
Beryllium Copper
Solder
0.13 in
3.3 mm
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 µin
0.76 µm
2.54 mm
0.1 in
UL94 V-0
1 A
-55 °C
125 °C
15.24 mm
DIP
0.6 in
40
0.6 in
DIP
15.24 mm
Beryllium Copper
Polysulfone (PSU), Glass Filled
Gold
Closed Frame
Through Hole
Gold
Beryllium Copper
Solder
0.13 in
3.3 mm
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 Áin
2.54 mm
0.1 in
UL94 V-0
1 A
-55 °C
125 °C
DIP
25.4 mm
40
DIP
1 "
25.4 mm
1 in
0.76 Ám
Beryllium Copper
Polysulfone (PSU), Glass Filled
Gold
Closed Frame
Through Hole
Gold
Beryllium Copper
Wire Wrap
30 Áin
0.76 Ám
0.1 in
2.54 mm
30 µin
0.76 µm
2.54 mm
0.1 in
UL94 V-0
1 A
-55 °C
125 °C
15.24 mm
DIP
0.6 in
40
0.6 in
DIP
15.24 mm
0.62 in
15.75 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 147.32
10$ 114.97
25$ 104.75
50$ 97.87
100$ 91.64
NewarkEach 1$ 164.34

Description

General part information

240 Series

40 (4 x 10) Pos QFN Socket Gold Through Hole