Specification	SEAMP-40-02.0-S-08-TR

Connector Type	MALE, High Density Array
Contact Finish	Gold
Contact Finish Thickness	30 µin
Height Above Board	0.181 in
Mated Stacking Height Options	7mm, 8mm, 8.5mm
Mounting Type	Through Hole
Number of Positions	320
Number of Rows	8
Pitch	0.05 in

SEAMP Series

Part	Contact Finish Thickness	Connector Type	Height Above Board	Contact Finish	Mated Stacking Height Options	Number of Rows	Pitch	Mounting Type	Number of Positions	Features
Samtec Inc. SEAMP-20-02.0-S-08-GP-TR	30 µin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	8	0.05 in	Through Hole	160	Board Guide
Samtec Inc. SEAMP-40-02.0-L-06-TR	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	6	0.05 in	Through Hole	240
Samtec Inc. SEAMP-50-02.0-L-04	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	4	0.05 in	Through Hole	200
Samtec Inc. SEAMP-10-02.0-S-06-GP	30 µin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	6	0.05 in	Through Hole	60	Board Guide
Samtec Inc. SEAMP-50-02.0-S-10-TR	30 µin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	10	0.05 in	Through Hole	500
Samtec Inc. SEAMP-40-02.0-S-08-TR	30 µin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	8	0.05 in	Through Hole	320
Samtec Inc. SEAMP-20-02.0-L-04-TR	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	4	0.05 in	Through Hole	80
Samtec Inc. SEAMP-40-02.0-L-04-GP-TR	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	4	0.05 in	Through Hole	160	Board Guide
Samtec Inc. SEAMP-40-02.0-L-06	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	6	0.05 in	Through Hole	240
Samtec Inc. SEAMP-10-02.0-L-04-TR	10 Ąin	High Density Array MALE	0.181 in	Gold	7mm 8.5mm 8mm	4	0.05 in	Through Hole	40

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