Technical Specifications
Parameters and characteristics for this part
| Specification | SEAMP-40-02.0-L-04-GP-TR |
|---|---|
| Connector Type | High Density Array, Male |
| Contact Finish | Gold |
| Contact Finish Thickness | 10 Áin |
| Contact Finish Thickness | 0.25 Ám |
| Features | Board Guide |
| Height Above Board | 0.181 in |
| Height Above Board | 4.6 mm |
| Mated Stacking Heights | 8 mm, 8.5 mm, 7 mm |
| Mounting Type | Through Hole |
| Number of Positions | 160 |
| Pitch [x] | 0.05 in |
| Pitch [x] | 1.27 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SEAMP Series
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
Documents
Technical documentation and resources