Specification	222-3343-00-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating	1 A
Features	Closed Frame
Grid Columns	11
Grid Rows	2
Housing Material	Polysulfone, PSU, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Connector
Number of Positions or Pins (Grid)	22
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.4 in
Termination	Press-Fit
Termination Post Length	0.11 in
Type	ZIF (ZIP), 0.4" (10.16mm) Row Spacing, DIP

222 Series

Part	Contact Finish - Post	Pitch - Post	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Contact Finish - Mating	Type	Row Spacing	Termination	Contact Finish Thickness - Post	Housing Material	Features	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Pitch - Mating	Contact Material - Post	Current Rating	Termination Post Length	Material Flammability Rating	Number of Pins	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Convert To (Adapter End)	Convert To (Adapter End) Type	Convert To (Adapter End) Row Spacing	Convert To (Adapter End) Size
3M Electronic Specialty 222-3343-00-0602J	Gold	0.1 in	125 °C	-55 °C	30 µin	Beryllium Copper	Connector	Gold	0.4" (10.16mm) Row Spacing DIP ZIF (ZIP)	0.4 in	Press-Fit	30 µin	Glass Filled Polysulfone PSU	Closed Frame	11	22	2	0.1 in	Beryllium Copper	1 A	0.11 in	UL94 V-0
3M Electronic Specialty 222-3343-09-0602J	Gold	0.1 in	125 °C	-55 °C	30 µin	Beryllium Copper	Through Hole	Gold			Solder	30 µin	Glass Filled Polysulfone PSU	Closed Frame				0.1 in	Beryllium Copper	1 A	0.13 in	UL94 V-0	22	DIP	DIP Row Spacing	0.4 "	DIP	Row Spacing	0.4 in	0.4 in
3M Electronic Specialty 222-3343-19-0602J	Gold	0.1 in	125 °C	-55 °C	30 µin	Beryllium Copper	Through Hole	Gold			Wire Wrap	30 µin	Glass Filled Polysulfone PSU	Closed Frame				0.1 in	Beryllium Copper	1 A	0.62 in	UL94 V-0	22	DIP	DIP Row Spacing	0.4 "	DIP	Row Spacing	0.4 in	0.4 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources