222 Series
Manufacturer: 3M Electronic Specialty
Beta
⌘K
IC & COMPONENT SOCKET, 22 CONTACTS, DIP SOCKET, 2.54 MM, 222 SERIES, 10.16 MM, BERYLLIUM COPPER
| Part | Contact Finish - Post | Pitch - Post | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Contact Finish - Mating | Type | Row Spacing | Termination | Contact Finish Thickness - Post | Housing Material | Features | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Pitch - Mating | Contact Material - Post | Current Rating | Termination Post Length | Material Flammability Rating | Number of Pins | Convert From (Adapter End) | Convert From (Adapter End) Type | Convert From (Adapter End) Row Spacing | Convert To (Adapter End) | Convert To (Adapter End) Type | Convert To (Adapter End) Row Spacing | Convert To (Adapter End) Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 3M Electronic Specialty | Gold | 0.1 in | 125 °C | -55 °C | 30 µin | Beryllium Copper | Connector | Gold | 0.4" (10.16mm) Row Spacing DIP ZIF (ZIP) | 0.4 in | Press-Fit | 30 µin | Glass Filled Polysulfone PSU | Closed Frame | 11 | 22 | 2 | 0.1 in | Beryllium Copper | 1 A | 0.11 in | UL94 V-0 | ||||||||
 3M Electronic Specialty | Gold | 0.1 in | 125 °C | -55 °C | 30 µin | Beryllium Copper | Through Hole | Gold | Solder | 30 µin | Glass Filled Polysulfone PSU | Closed Frame | 0.1 in | Beryllium Copper | 1 A | 0.13 in | UL94 V-0 | 22 | DIP | DIP Row Spacing | 0.4 " | DIP | Row Spacing | 0.4 in | 0.4 in | |||||
 3M Electronic Specialty | Gold | 0.1 in | 125 °C | -55 °C | 30 µin | Beryllium Copper | Through Hole | Gold | Wire Wrap | 30 µin | Glass Filled Polysulfone PSU | Closed Frame | 0.1 in | Beryllium Copper | 1 A | 0.62 in | UL94 V-0 | 22 | DIP | DIP Row Spacing | 0.4 " | DIP | Row Spacing | 0.4 in | 0.4 in |