8468-11B1-RK-TP

Obsolete

3M Electronic Specialty

IC & COMPONENT SOCKET, 68 CONTACTS, PLCC SOCKET, 2.54 MM, 8400 SERIES, COPPER ALLOY

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8468-11B1-RK-TP

Obsolete

3M Electronic Specialty

IC & COMPONENT SOCKET, 68 CONTACTS, PLCC SOCKET, 2.54 MM, 8400 SERIES, COPPER ALLOY

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Description Specifications Series Pricing CAD Documents

Description

General part information

8468 Series

Industry standard socket for JEDEC A/B PLCCs, incorporating internal standoffs for precision chip positioning, bottom standoffs for simpler flux residue removal and 2.54mm grid solder tails. UL recognised.

Technical Specifications

Parameters and characteristics for this part

Specification	8468-11B1-RK-TP

Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	160 µin
Contact Finish Thickness - Post	160 µin
Contact Material - Mating	Copper Alloy
Contact Material - Post	Copper Alloy
Current Rating	1 A
Features	Closed Frame
Grid Columns	17
Grid Rows	4
Housing Material	Glass Filled, Polybutylene Terephthalate, PBT
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	68
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Pitch - Mating	0.05 in
Pitch - Post	0.05 in
Termination	Solder
Termination Post Length	0.132 in
Type	PLCC

8468 Series

Part	Contact Finish - Post	Type	Operating Temperature (Min)	Operating Temperature (Max)	Mounting Type	Pitch - Mating	Features	Pitch - Post	Contact Material - Post	Contact Material - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Termination	Material Flammability Rating	Termination Post Length	Current Rating	Contact Resistance
3M Electronic Specialty 8468-11B1-RK-TP	Tin	PLCC	-40 °C	105 °C	Through Hole	0.05 in	Closed Frame	0.05 in	Copper Alloy	Copper Alloy	Glass Filled PBT Polybutylene Terephthalate	160 µin	Tin	160 µin	4	17	68	Solder	UL94 V-0	0.132 in	1 A
3M Electronic Specialty 8468-21A1-RK-TP	Tin	PLCC	-40 °C	105 °C	Surface Mount	0.05 in	Closed Frame	0.05 in	Copper Alloy	Copper Alloy	Glass Filled PBT Polybutylene Terephthalate	160 µin	Tin	160 µin	4	17	68	Solder	UL94 V-0	0.132 in	1 A
3M Electronic Specialty 8468-21B1-RK-TP	Tin	PLCC	-40 °C	105 °C	Surface Mount	0.05 in	Closed Frame	0.05 in	Copper Alloy	Copper Alloy	Glass Filled PBT Polybutylene Terephthalate	160 µin	Tin	160 µin	4	17	68	Solder	UL94 V-0	0.132 in	1 A
3M Electronic Specialty 8468-21B1-RK-TR	Tin	PLCC	-40 °C	105 °C	Surface Mount	0.05 in	Closed Frame	0.05 in	Copper Alloy	Copper Alloy	Glass Filled PBT Polybutylene Terephthalate	160 µin	Tin	160 µin	4	17	68	Solder	UL94 V-0	0.132 in	1 A	15 mOhm

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

8468-11B1-RK-TP | Datasheet