8468 Series
Manufacturer: 3M Electronic Specialty
IC & COMPONENT SOCKET, 68 CONTACTS, PLCC SOCKET, 2.54 MM, 8400 SERIES, COPPER ALLOY
| Part | Contact Finish - Post | Type | Operating Temperature (Min) | Operating Temperature (Max) | Mounting Type | Pitch - Mating | Features | Pitch - Post | Contact Material - Post | Contact Material - Mating | Housing Material | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Finish Thickness - Mating | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Termination | Material Flammability Rating | Termination Post Length | Current Rating | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M Electronic Specialty | Tin | PLCC | -40 °C | 105 °C | Through Hole | 0.05 in | Closed Frame | 0.05 in | Copper Alloy | Copper Alloy | Glass Filled PBT Polybutylene Terephthalate | 160 µin | Tin | 160 µin | 4 | 17 | 68 | Solder | UL94 V-0 | 0.132 in | 1 A | |
3M Electronic Specialty | Tin | PLCC | -40 °C | 105 °C | Surface Mount | 0.05 in | Closed Frame | 0.05 in | Copper Alloy | Copper Alloy | Glass Filled PBT Polybutylene Terephthalate | 160 µin | Tin | 160 µin | 4 | 17 | 68 | Solder | UL94 V-0 | 0.132 in | 1 A | |
3M Electronic Specialty | Tin | PLCC | -40 °C | 105 °C | Surface Mount | 0.05 in | Closed Frame | 0.05 in | Copper Alloy | Copper Alloy | Glass Filled PBT Polybutylene Terephthalate | 160 µin | Tin | 160 µin | 4 | 17 | 68 | Solder | UL94 V-0 | 0.132 in | 1 A | |
3M Electronic Specialty | Tin | PLCC | -40 °C | 105 °C | Surface Mount | 0.05 in | Closed Frame | 0.05 in | Copper Alloy | Copper Alloy | Glass Filled PBT Polybutylene Terephthalate | 160 µin | Tin | 160 µin | 4 | 17 | 68 | Solder | UL94 V-0 | 0.132 in | 1 A | 15 mOhm |