MCP2025 Series

Part	Protocol	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Package / Case	Type	Package Width	Package Name	Package Length	Duplex	Number of Drivers	Number of Receivers	Receiver Hysteresis	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)
Microchip Technology MCP2025T-330E/MD	LINbus	18 V	6 V	8-VDFN Exposed Pad	Transceiver	4 mm	8-DFN	4 mm	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025-500E/P	LINbus	18 V	6 V		Transceiver	7.62 mm	8-DIP 8-PDIP	0.3 in	Half	1	1	175 mV	Through Hole	125 °C	-40 °C
Microchip Technology MCP2025-500E/SN	LINbus	18 V	6 V		Transceiver	3.9 mm	8-SOIC	0.154 in	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025T-500E/SN	LINbus	18 V	6 V		Transceiver	3.9 mm	8-SOIC	0.154 in	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025-500E/MD	LINbus	18 V	6 V	8-VDFN Exposed Pad	Transceiver	4 mm	8-DFN	4 mm	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025T-330E/SN	LINbus	18 V	6 V		Transceiver	3.9 mm	8-SOIC	0.154 in	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025-330E/SN	LINbus	18 V	6 V		Transceiver	3.9 mm	8-SOIC	0.154 in	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C
Microchip Technology MCP2025-330E/P	LINbus	18 V	6 V		Transceiver	7.62 mm	8-DIP 8-PDIP	0.3 in	Half	1	1	175 mV	Through Hole	125 °C	-40 °C
Microchip Technology MCP2025T-500E/MD	LINbus	18 V	6 V	8-VDFN Exposed Pad	Transceiver	4 mm	8-DFN	4 mm	Half	1	1	175 mV	Surface Mount	125 °C	-40 °C

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