MCP2025 Series
Manufacturer: Microchip Technology
IC TRANSCEIVER HALF 1/1 8DFN
| Part | Protocol | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Package / Case | Type | Package Width | Package Name | Package Length | Duplex | Number of Drivers | Number of Receivers | Receiver Hysteresis | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | LINbus | 18 V | 6 V | 8-VDFN Exposed Pad | Transceiver | 4 mm | 8-DFN | 4 mm | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 7.62 mm | 8-DIP 8-PDIP | 0.3 in | Half | 1 | 1 | 175 mV | Through Hole | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 3.9 mm | 8-SOIC | 0.154 in | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 3.9 mm | 8-SOIC | 0.154 in | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | 8-VDFN Exposed Pad | Transceiver | 4 mm | 8-DFN | 4 mm | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 3.9 mm | 8-SOIC | 0.154 in | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 3.9 mm | 8-SOIC | 0.154 in | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | Transceiver | 7.62 mm | 8-DIP 8-PDIP | 0.3 in | Half | 1 | 1 | 175 mV | Through Hole | 125 °C | -40 °C | |
Microchip Technology | LINbus | 18 V | 6 V | 8-VDFN Exposed Pad | Transceiver | 4 mm | 8-DFN | 4 mm | Half | 1 | 1 | 175 mV | Surface Mount | 125 °C | -40 °C |