CYW20706UA2KFFB4GT
ActiveRF TRANSCEIVER, 2.402 TO 2.48GHZ, 3MBPS ROHS COMPLIANT: YES
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CYW20706UA2KFFB4GT
ActiveRF TRANSCEIVER, 2.402 TO 2.48GHZ, 3MBPS ROHS COMPLIANT: YES
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | CYW20706UA2KFFB4GT |
|---|---|
| Current - Receiving | 12.5 mA |
| Current - Transmitting | 26.5 mA |
| Data Rate (Max) | 2 Mbps |
| Frequency | 2.4 GHz |
| GPIO | 24 |
| Memory Size [custom] | 352 kB |
| Memory Size [custom] | 848 kB |
| Modulation | GFSK, 4DQPSK, 8DPSK |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -30 ░C |
| Package / Case | 49-TFBGA |
| Power - Output | 12 dBm |
| Protocol | Bluetooth v4.2 |
| RF Family/Standard | Bluetooth |
| Sensitivity | -96.5 dBm |
| Serial Interfaces | SPI, I2C, I2S, UART |
| Supplier Device Package | 49-FBGA (4.5x4) |
| Type | TxRx + MCU |
| Voltage - Supply | 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Arrow | N/A | 2500 | $ 2.67 | |
| Digikey | Cut Tape (CT) | 1 | $ 6.08 | |
| 10 | $ 5.43 | |||
| 25 | $ 4.89 | |||
| 100 | $ 4.45 | |||
| 250 | $ 4.02 | |||
| 500 | $ 3.60 | |||
| 1000 | $ 3.04 | |||
| Digi-Reel® | 1 | $ 6.08 | ||
| 10 | $ 5.43 | |||
| 25 | $ 4.89 | |||
| 100 | $ 4.45 | |||
| 250 | $ 4.02 | |||
| 500 | $ 3.60 | |||
| 1000 | $ 3.04 | |||
| Tape & Reel (TR) | 2500 | $ 3.08 | ||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 6.34 | |
| 10 | $ 4.63 | |||
| 25 | $ 4.44 | |||
| 50 | $ 4.25 | |||
| 100 | $ 4.07 | |||
| 250 | $ 3.76 | |||
| 500 | $ 3.57 | |||
| 1000 | $ 3.27 | |||
Description
General part information
CYW20706 Series
The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20706 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions. The AIROC™ CYW20706 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, Bluetooth® Mesh, or any Bluetooth® connected IoT application. AIROC™ CYW20706 Modules Infineon's AIROC™ CYW20706 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20706 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™CYBT-343151-02,CYBT-333032-02,CYBT-343026-01andCYBT-353027-02are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
Documents
Technical documentation and resources