40-3574-16

Active

Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Search across all available documentation for this part.

Active

Aries Electronics

40P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	40-3574-16

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Mounting Type	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post	Termination
Aries Electronics 40-3574-18	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	40	20	2	1 A	UL94 V-0	Gold	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	Closed Frame	10 çin	0.25 çm	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Solder
Aries Electronics 40-3574-16	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	40	20	2	1 A	UL94 V-0	Gold	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	Closed Frame	10 çin	0.25 çm	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Solder

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources