40-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Mounting Type	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post	Termination
Aries Electronics 40-3574-18	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	40	20	2	1 A	UL94 V-0	Gold	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	Closed Frame	10 çin	0.25 çm	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Solder
Aries Electronics 40-3574-16	10 çin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	40	20	2	1 A	UL94 V-0	Gold	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	Closed Frame	10 çin	0.25 çm	Beryllium Copper	0.1 in	2.54 mm	Beryllium Copper	Solder