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VQFN (RGZ)

CC2652R1FRGZR

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Texas Instruments

SIMPLELINK™ 32-BIT ARM CORTEX-M4F MULTIPROTOCOL 2.4 GHZ WIRELESS MCU WITH 352KB FLASH

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VQFN (RGZ)

CC2652R1FRGZR

Active
Texas Instruments

SIMPLELINK™ 32-BIT ARM CORTEX-M4F MULTIPROTOCOL 2.4 GHZ WIRELESS MCU WITH 352KB FLASH

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Description

General part information

CC2652 Series

The SimpleLink™ CC2652P7 device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supportingThread,Zigbee, Matter,Bluetooth5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN),TI 15.4-Stack(2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The CC2652P7 is based on an Arm®Cortex®M4F main processor and optimized for low-power wireless communication and advanced sensing ingrid infrastructure,building automation,retail automation,personal electronicsandmedical applications.

The CC2652P7 has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver. The CC2652P7 has an efficient built-in PA that supports +10 dBm TX at 21 mA and +20 dBM TX at 101 mA in 2.4-GHz band. CC2652P7 has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2652P7 has a low sleep current of 0.9 µA with RTC and 144KB RAM retention. In addition to the main Cortex® M4F processor, the device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-µA system current.

Technical Specifications

Parameters and characteristics for this part

SpecificationCC2652R1FRGZR
Current - Receiving6.9 mA
Current - Transmitting (Max)9.6 mA
Current - Transmitting (Min)7.3 mA
Data Rate (Max)2 MBaud
Frequency (Max)2.48 GHz
Frequency (Min)2.4 GHz
GPIO Count31
Memory Size80 kB
Memory Size (Flash)352 kB
Memory TypeFlash, RAM
ModulationDSSS, O-QPSK
Mounting TypeSurface Mount
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Package / Case48-VFQFN Exposed Pad
Package Length7 mm
Package Name48-VQFN
Package Width7 mm
Power - Output5 dBm
ProtocolThread, Zigbee®, Bluetooth v5.2
RF Family/Standard802.15.4, Bluetooth
Sensitivity-105 dBm
Serial InterfacesUART, SPI, I2C, JTAG, GPIO, I2S, ADC
TypeTxRx + MCU
Voltage - Supply (Maximum)3.8 V
Voltage - Supply (Minimum)1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

TI Bluetooth® Mesh Software Product Brief
TI extends support of Amazon Sidewalk to improve connectivity between homes, neighborhoods and cities
Out-of-box star-network solution: TI 15.4-Stack
Understanding security features for SimpleLink™ Zigbee CC13x2 and CC26x2 Wireles
CC2652RSimpleLink™ Multiprotocol 2.4 GHz Wireless MCU datasheet (Rev. J)
Going crystal-less is easy with the world's first crystal-less, wireless SimpleLin
How to create a robust building security system with TI’s SimpleLink MCU platform
Secure Boot in SimpleLink™ CC13x2/CC26x2 Wireless MCUs
Dynamic Multi-Protocol (DMM) Performance
How Wi-Fi® and Bluetooth® Low Energy can coexist in building automation and medic
Deep dive into the tools and development kits of the SimpleLink™ MCU platform (Rev. B)
Electronic Smart Locks: Ultra-low power and Multi-Standard operation
無線連線技術選擇指南 (Rev. B)
Debugging Communication Range (Rev. A)
Seamlessly connect your world with 16 new wireless MCUs for the 2.4-GHz and Sub-1-
Meet the SimpleLink™ Sensor Controller
Z-Stack End Dev Pwr Cons Measuremen w/ the SimpleLink™ Wireless MCU Family (Rev. B)
5 things to know about the newest devices of the SimpleLink MCU platform
An out-of-the-box Internet of Things: building a seamless and secure smart home ne
Bluetooth® Low Energy Tree Structure Network
Cryptographic Performance and Energy Efficiency on SimpleLink CC13x2/CC26x2 MCUs
Time Multiplexing: Concurrent Multi-standard Operation
Use of Low-power Zigbee® and Thread With the SimpleLink™ Wireless MCU Family
CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A)
CC13xx/CC26xx Hardware Configuration and PCB Design Considerations (Rev. H)
Thread vs. Zigbee – what’s the difference?
Measuring CC13xx and CC26xx current consumption (Rev. D)
Dynamic Multi-protocol Manager (DMM) Tech Note (Rev. A)
Zigbee® Selection Guide for SimpleLink MCUs (Rev. F)
Antenna Impedance Measurement and Matching
How to Certify Your Bluetooth Product (Rev. M)
What's New in Zigbee 3.0 (Rev. A)
Migrating your proprietary solution to the SimpleLink™ WMCU
How to Do RF Radio Test With Your Bluetooth Product (Rev. A)
Z-Stack Large Mesh Network Performance Using the SimpleLink™ Wireless MCU Family (Rev. B)
CC13x2, CC26x2 SimpleLink Wireless MCU Technical Reference Manual (Rev. G)
Simple and efficient software development with the SimpleLink™ MCU platform (Rev. E)
Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A)
SimpleLink Crystal-Less Wireless MCU based on TI BAW technology
Ultra-Low Power Designs With the CC13x2 and CC26x2 Sensor Controller
무선 연결 기술 선택 가이드 (Rev. B)
Low-Power ADC Solution for CC13x2 and CC26x2
Wireless Connectivity Technology Selection Guide (Rev. B)
RF PCB Simulation Cookbook
TI-15.4 Stack Frequency Hopping Mode FCC Compliance (Rev. A)
Sensor Sequencing Using the CC13x2 and CC26x2 Sensor Controller
Exploring IoT wireless connectivity in mechanical shock and vibration environme
Hardware Migration From CC26x0 to CC26x2R (Rev. D)
Running Bluetooth® Low Energy on CC13x2/CC26xx Without a 32 kHz Crystal (Rev. C)
Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B)
Configuring Bluetooth LE devices for Direct Test Mode
Exploring Thread and Zigbee for home and building automation
Thread and Zigbee for home and building automation
CC2652R SimpleLink™ Wireless MCU Device Revision E Silicon Errata (Rev. D)
Your microcontroller deserves a nap – designing "sleepy" wireless applications
The "key" to security: Zigbee 3.0’s security features
TI Bluetooth: Invalid RPA Leading to DoS for Bonded Devices (CVE-2023-52709) (Rev. A)
CC2538, CC13xx, and CC26xx Serial Bootloader Interface (Rev. E)
SimpleLink WLAN Access Point (Rev. A)
An FAQ about the Matter connectivity standard
Ultra-Low Power Sensing Applications With CC13x2/CC26x2 (Rev. B)
Connect One TI 15.4 Stack Sensor to Multiple Gateways
Cloning Z-Stack Network Properties Using the SimpleLink Wireless MCU Family