18-3518-10

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Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

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18-3518-10

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Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	18-3518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	18
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

18-3518 Series

Part	Housing Material	Mounting Type	Current Rating (Amps)	Contact Finish - Mating	Features	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Termination	Contact Finish - Post
Aries Electronics 18-3518-112	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	18	10 çin	0.25 çm	Brass	Solder	Gold
Aries Electronics 18-3518-102	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-01	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-101	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-10H	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 2.42
		10	$ 1.84
		25	$ 1.66
		50	$ 1.54
		100	$ 1.42
		250	$ 1.29
		500	$ 1.20
		1000	$ 1.11
		2500	$ 1.02

Description

General part information

18-3518 Series

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources