18-3518 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Housing Material	Mounting Type	Current Rating (Amps)	Contact Finish - Mating	Features	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Termination	Contact Finish - Post
Aries Electronics 18-3518-112	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	18	10 çin	0.25 çm	Brass	Solder	Gold
Aries Electronics 18-3518-102	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-01	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-10	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-101	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin
Aries Electronics 18-3518-10H	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	3 A	Gold	Open Frame	3.18 mm	0.125 in	Beryllium Copper	0.1 in	2.54 mm	UL94 V-0	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	18	10 çin	0.25 çm	Brass	Solder	Tin