Technical Specifications
Parameters and characteristics commom to parts in this series
Specification | TPD2E007YFMRG4 | TPD2E007 Series |
---|---|---|
Applications | General Purpose | General Purpose |
Bidirectional Channels | 2 | 2 |
Mounting Type | Surface Mount | Surface Mount |
Operating Temperature [Max] | 85 °C | 85 °C |
Operating Temperature [Min] | -40 °C | -40 °C |
Package / Case | DSLGA, 4-XFLGA | DSLGA, 4-XFLGA, SOT-323, SC-70 |
Power Line Protection | False | False |
Supplier Device Package | 4-DSLGA | 4-DSLGA, SC-70-3 |
Type | Zener | Zener |
Voltage - Breakdown (Min) [Min] | 14 V | 14 V |
Voltage - Reverse Standoff (Typ) | 13 V | 13 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
TPD2E007 Series
TVS DIODE 13VWM 4DSLGA
Part | Applications | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Type | Voltage - Reverse Standoff (Typ) | Supplier Device Package | Package / Case | Voltage - Breakdown (Min) [Min] | Bidirectional Channels | Power Line Protection |
---|---|---|---|---|---|---|---|---|---|---|---|
General Purpose | 85 °C | -40 °C | Surface Mount | Zener | 13 V | 4-DSLGA | 4-XFLGA, DSLGA | 14 V | 2 | ||
Texas Instruments TPD2E007DCKRThis device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs. | General Purpose | 85 °C | -40 °C | Surface Mount | Zener | 13 V | SC-70-3 | SC-70, SOT-323 | 14 V | 2 | |
Texas Instruments TPD2E007YFMTG4This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs. | General Purpose | 85 °C | -40 °C | Surface Mount | Zener | 13 V | 4-DSLGA | 4-XFLGA, DSLGA | 14 V | 2 |
Description
General part information
TPD2E007 Series
Clamp Ipp Tvs Diode Surface Mount 4-DSLGA