
PMV65XPEAR
ActiveNexperia USA Inc.
TRANS MOSFET P-CH 20V 3.3A 3-PIN TO-236AB T/R

PMV65XPEAR
ActiveNexperia USA Inc.
TRANS MOSFET P-CH 20V 3.3A 3-PIN TO-236AB T/R
Description
General part information
PMV65XPEA Series
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMV65XPEAR |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 2.8 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Drive Voltage (Max Rds On) | 2.5 V |
| Drive Voltage (Min Rds On) | 4.5 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 9 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 618 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | TO-236-3, SOT-23-3, SC-59 |
| Package Name | TO-236AB |
| Power Dissipation (Max) | 6.25 W, 480 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 78 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 12 V |
| Vgs(th) (Max) | 1.25 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Using power MOSFETs in parallel
RC Thermal Models
Wave soldering profile
Reflow soldering profile
Power MOSFET frequently asked questions and answers
LFPAK MOSFET thermal design guide, Chinese version
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
LFPAK MOSFET thermal design guide - Part 2
Questions about package outline drawings
Nexperia package poster
Reel pack for SMD, 7"; Q3/T4 product orientation
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body