Specification	ESS-115-TT-06

Connector Type	Elevated Socket
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Length - Post	0.215 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.3 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	15
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

ESS-115 Series

Part	Contact Finish - Mating	Contact Type	Number of Positions Loaded	Number of Positions	Insulation Height	Termination	Contact Finish Thickness - Mating	Fastening Type	Insulation Color	Number of Rows	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Material Flammability Rating	Style	Mounting Type	Contact Length - Post	Pitch - Mating	Contact Finish Thickness - Post	Contact Material	Insulation Material	Contact Shape
Samtec Inc. ESS-115-G-28	Gold	Female Socket	All	15	0.3 in	Solder	10 µin	Push-Pull	Black	1	Gold	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.373 in	0.1 in	10 µin	Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-TT-23	Tin	Female Socket	All	15	0.3 in	Solder		Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.123 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-T-06	Gold	Female Socket	All	15	0.3 in	Solder	10 µin	Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.215 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-TT-06	Tin	Female Socket	All	15	0.3 in	Solder		Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.215 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-T-23	Gold	Female Socket	All	15	0.3 in	Solder	10 µin	Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.123 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-T-03	Gold	Female Socket	All	15	0.3 in	Solder	10 µin	Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.123 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-T-05	Gold	Female Socket	All	15	0.5 in	Solder	10 µin	Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.173 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-T-04	Gold	Female Socket	All	15	0.4 in	Solder	10 µin	Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.123 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular
Samtec Inc. ESS-115-TT-04	Tin	Female Socket	All	15	0.4 in	Solder		Push-Pull	Black	1	Tin	125 °C	-55 °C	Elevated Socket	UL94 V-0	Board	Through Hole	0.123 in	0.1 in		Beryllium Copper	Liquid Crystal Polymer (LCP)	Circular

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ESS-115-TT-06 | Datasheet