ESS-115 Series
Manufacturer: Samtec Inc.
CONN SOCKET 15POS 0.1 GOLD PCB
| Part | Contact Finish - Mating | Contact Type | Number of Positions Loaded | Number of Positions | Insulation Height | Termination | Contact Finish Thickness - Mating | Fastening Type | Insulation Color | Number of Rows | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Connector Type | Material Flammability Rating | Style | Mounting Type | Contact Length - Post | Pitch - Mating | Contact Finish Thickness - Post | Contact Material | Insulation Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Female Socket | All | 15 | 0.3 in | Solder | 10 µin | Push-Pull | Black | 1 | Gold | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.373 in | 0.1 in | 10 µin | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |
Samtec Inc. | Tin | Female Socket | All | 15 | 0.3 in | Solder | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.123 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | Gold | Female Socket | All | 15 | 0.3 in | Solder | 10 µin | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.215 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | |
Samtec Inc. | Tin | Female Socket | All | 15 | 0.3 in | Solder | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.215 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | ||
Samtec Inc. | Gold | Female Socket | All | 15 | 0.3 in | Solder | 10 µin | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.123 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | |
Samtec Inc. | Gold | Female Socket | All | 15 | 0.3 in | Solder | 10 µin | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.123 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | |
Samtec Inc. | Gold | Female Socket | All | 15 | 0.5 in | Solder | 10 µin | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.173 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | |
Samtec Inc. | Gold | Female Socket | All | 15 | 0.4 in | Solder | 10 µin | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.123 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular | |
Samtec Inc. | Tin | Female Socket | All | 15 | 0.4 in | Solder | Push-Pull | Black | 1 | Tin | 125 °C | -55 °C | Elevated Socket | UL94 V-0 | Board | Through Hole | 0.123 in | 0.1 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Circular |