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42-3574-16

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Aries Electronics

CONN IC DIP SOCKET ZIF 42POS TIN

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42-3574-16

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 42POS TIN

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification42-3574-16
Contact Finish - PostTin
Contact Finish Thickness - Mating5.08 µm
Contact Finish Thickness - Mating200 µin
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)42
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
Type7.62 mm
Type0.3 in
TypeDIP, ZIF (ZIP)

42-3574 Series

PartHousing MaterialContact Material - PostContact Finish Thickness - MatingContact Finish Thickness - MatingNumber of Positions or Pins (Grid)Contact Finish - PostCurrent Rating (Amps)Material Flammability RatingContact Material - MatingContact Finish Thickness - PostContact Finish Thickness - PostFeaturesTermination Post LengthTermination Post LengthTerminationPitch - MatingPitch - MatingPitch - PostPitch - PostTypeTypeTypeMounting Type
Aries Electronics
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
5.08 µm
200 µin
42
Tin
1 A
UL94 V-0
Beryllium Copper
200 µin
5.08 µm
Closed Frame
0.11 in
2.78 mm
Solder
0.1 in
2.54 mm
2.54 mm
0.1 in
7.62 mm
0.3 in
DIP
ZIF (ZIP)
Through Hole
Aries Electronics
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
5.08 µm
200 µin
42
Tin
1 A
UL94 V-0
Beryllium Copper
200 µin
5.08 µm
Closed Frame
0.11 in
2.78 mm
Solder
0.1 in
2.54 mm
2.54 mm
0.1 in
7.62 mm
0.3 in
DIP
ZIF (ZIP)
Through Hole
Aries Electronics
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
5.08 µm
200 µin
42
Tin
1 A
UL94 V-0
Beryllium Copper
200 µin
5.08 µm
Closed Frame
0.11 in
2.78 mm
Solder
0.1 in
2.54 mm
2.54 mm
0.1 in
7.62 mm
0.3 in
DIP
ZIF (ZIP)
Through Hole
Aries Electronics
Polyphenylene Sulfide (PPS)
Glass Filled
Beryllium Copper
5.08 µm
200 µin
42
Tin
1 A
UL94 V-0
Beryllium Copper
200 µin
5.08 µm
Closed Frame
0.11 in
2.78 mm
Solder
0.1 in
2.54 mm
2.54 mm
0.1 in
7.62 mm
0.3 in
DIP
ZIF (ZIP)
Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 6$ 79.48

Description

General part information

42-3574 Series

42 (2 x 21) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Documents

Technical documentation and resources