42-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Material Flammability Rating	Termination Post Length	Current Rating	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Finish - Mating	Contact Material - Mating	Mounting Type	Contact Material - Post	Pitch - Mating	Row Spacing	Type	Contact Finish Thickness - Post	Contact Finish - Post	Features	Contact Finish Thickness - Mating	Housing Material	Termination	Pitch - Post
Aries Electronics 42-3574-10	UL94 V-0	0.11 in	1 A	42	21	2	Tin	Beryllium Copper	Through Hole	Beryllium Copper	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 µin	Tin	Closed Frame	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Solder	0.1 in
Aries Electronics 42-3574-16	UL94 V-0	0.11 in	1 A	42	21	2	Tin	Beryllium Copper	Through Hole	Beryllium Copper	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 µin	Tin	Closed Frame	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Solder	0.1 in
Aries Electronics 42-3574-18	UL94 V-0	0.11 in	1 A	42	21	2	Tin	Beryllium Copper	Through Hole	Beryllium Copper	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 µin	Tin	Closed Frame	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Solder	0.1 in
Aries Electronics 42-3574-11	UL94 V-0	0.11 in	1 A	42	21	2	Tin	Beryllium Copper	Through Hole	Beryllium Copper	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 µin	Tin	Closed Frame	200 Ąin	Glass Filled Polyphenylene Sulfide PPS	Solder	0.1 in