Zenode.ai Logo

232-1270-01-0602

Active
3M

CONN SOCKET PGA ZIF 32POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

232-1270-01-0602

Active
3M

CONN SOCKET PGA ZIF 32POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification232-1270-01-0602232 Series
Adhesive-Rubber
Backing, Carrier-Crepe Paper, Treated, Paper
Color-Tan
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating30 Áin30 Áin
Contact Finish Thickness - Mating0.76 Ám0.76 Ám
Contact Finish Thickness - Post30 µin30 µin
Contact Finish Thickness - Post0.76 µm0.76 µm
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - PostBeryllium CopperBeryllium Copper
Contact Resistance25 mOhm15 - 25 mOhm
Convert From (Adapter End)-15.24 mm
Convert From (Adapter End)-DIP
Convert From (Adapter End)-0.6 in
Convert To (Adapter End)-0.6 in
Convert To (Adapter End)-DIP
Convert To (Adapter End)-15.24 mm
Current Rating (Amps)1 A1 A
FeaturesClosed FrameClosed Frame
Housing MaterialPolysulfone (PSU), Glass FilledPolysulfone (PSU), Glass Filled, Polyethersulfone (PES)
Length-60 yds
Length-55 m
Length-180 ft
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleConnector, Through Hole
Number of Pins-32
Number of Positions or Pins (Grid)-32
Number of Positions or Pins (Grid)-32
Number of Positions or Pins (Grid) [custom]2 x 162 x 16, 1 x 32
Number of Positions or Pins (Grid) [custom]3232
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-55 °C-55 °C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
Shelf Life-12 Months
Shelf Life Start-Date of Manufacture
Storage/Refrigeration Temperature-70 °F
Storage/Refrigeration Temperature-21 °C
Tape Type-Masking
TerminationSolderPress-Fit, Solder, Wire Wrap
Termination Post Length-0.11 - 0.13 in
Termination Post Length-2.78 - 3.3 mm
Termination Post Length [x]3.9 mm2.9 - 15.75 mm
Termination Post Length [x]0.154 in0.114 - 0.62 in
Thickness-6.3 mils
Thickness-0.0063 "
Thickness-0.16 mm
TypeZIF (ZIP), PGADIP, ZIF (ZIP), ZIF (ZIP), PGA, QFN, SIP
Type-15.24 mm
Type-0.6 "
Usage-Medium Temp, Paint Bake
Width-48 - 72 mm
Width-1.89 - 2.83 "
Width-0.47 - 3.78 in
Width-12 - 96 mm

232 Series

TAPE MASKING TAN 15/16"X60YDS

PartShelf LifeUsageColorAdhesiveStorage/Refrigeration TemperatureStorage/Refrigeration TemperatureTape TypeShelf Life StartThicknessThicknessThicknessBacking, CarrierLengthLengthLengthWidth [y]Width [y]Contact ResistanceWidth [x]Width [x]Contact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - MatingTerminationMaterial Flammability RatingContact Material - MatingTypeTypeTypePitch - MatingPitch - MatingNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Contact Material - PostPitch - PostPitch - PostContact Finish - MatingContact Finish Thickness - PostContact Finish Thickness - PostHousing MaterialMounting TypeCurrent Rating (Amps)Operating Temperature [Min]Operating Temperature [Max]Termination Post LengthTermination Post LengthFeaturesTermination Post Length [x]Termination Post Length [x]Number of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]Convert To (Adapter End)Convert To (Adapter End)Convert To (Adapter End)Number of PinsConvert From (Adapter End)Convert From (Adapter End)Convert From (Adapter End)
12 Months
Medium Temp, Paint Bake
Tan
Rubber
70 °F
21 °C
Masking
Date of Manufacture
6.3 mils
0.0063 "
0.16 mm
Crepe Paper, Treated
60 yds
55 m
180 ft
12 Months
Tan
Rubber
70 °F
21 °C
Masking
Date of Manufacture
6.3 mils
0.0063 "
0.16 mm
Paper
60 yds
55 m
180 ft
72 mm
2.83 "
25 mOhm
12 Months
Medium Temp, Paint Bake
Tan
Rubber
70 °F
21 °C
Masking
Date of Manufacture
6.3 mils
0.0063 "
0.16 mm
Crepe Paper, Treated
60 yds
55 m
180 ft
1.42 in
36 mm
25 mOhm
12 Months
Medium Temp, Paint Bake
Tan
Rubber
70 °F
21 °C
Masking
Date of Manufacture
6.3 mils
0.0063 "
0.16 mm
Crepe Paper, Treated
60 yds
55 m
180 ft
0.71 in
18 mm
15 mOhm
Gold
30 Áin
0.76 Ám
Press-Fit
UL94 V-0
Beryllium Copper
15.24 mm
DIP, ZIF (ZIP)
0.6 "
0.1 in
2.54 mm
2 x 16
32
Beryllium Copper
2.54 mm
0.1 in
Gold
30 µin
0.76 µm
Polysulfone (PSU), Glass Filled
Connector
1 A
-55 °C
125 °C
0.11 in
2.78 mm
Closed Frame
Gold
30 Áin
0.76 Ám
Press-Fit
UL94 V-0
Beryllium Copper
15.24 mm
DIP, ZIF (ZIP)
0.6 "
0.1 in
2.54 mm
2 x 16
32
Beryllium Copper
2.54 mm
0.1 in
Gold
30 µin
0.76 µm
Polysulfone (PSU), Glass Filled
Connector
1 A
-55 °C
125 °C
0.11 in
2.78 mm
Closed Frame
25 mOhm
Gold
30 Áin
0.76 Ám
Solder
UL94 V-0
Beryllium Copper
PGA, ZIF (ZIP)
0.1 in
2.54 mm
2 x 16
32
Beryllium Copper
2.54 mm
0.1 in
Gold
30 µin
0.76 µm
Polysulfone (PSU), Glass Filled
Through Hole
1 A
-55 °C
125 °C
Closed Frame
3.9 mm
0.154 in
25 mOhm
Gold
Solder
Beryllium Copper
QFN
Beryllium Copper
Gold
Polyethersulfone (PES)
Through Hole
Closed Frame
2.9 mm
0.114 in
32

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

232 Series

32 (2 x 16) Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Documents

Technical documentation and resources