SSW-139-01-G-S
ActiveSamtec Inc.
CONN RCPT 39POS 0.1 GOLD PCB
Deep-Dive with AI
Search across all available documentation for this part.
SSW-139-01-G-S
ActiveSamtec Inc.
CONN RCPT 39POS 0.1 GOLD PCB
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SSW-139-01-G-S |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.51 µm |
| Contact Finish Thickness - Mating | 20 µin |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Post | 0.104 in |
| Contact Length - Post | 2.64 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.7 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.335 " |
| Insulation Height | 8.51 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 39 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
SSW-139 Series
| Part | Insulation Height [z] | Insulation Height [z] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Connector Type | Style | Contact Length - Post | Contact Length - Post | Fastening Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Shape | Current Rating (Amps) | Insulation Material | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Number of Rows | Mounting Type | Contact Material | Insulation Color | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Contact Type | Number of Positions | Number of Positions Loaded | Insulation Height | Insulation Height | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.095 in | 2.41 mm | 3 µin | 0.076 µm | Gold | Receptacle | Board to Board Cable | 2.54 mm | 0.1 in | Push-Pull | 0.51 µm | 20 µin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 1 | Through Hole Right Angle | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 39 | All | |||||
Samtec Inc. | 3 µin | 0.076 µm | Gold | Receptacle | Board to Board Cable | 2.64 mm | 0.104 in | Push-Pull | 0.51 µm | 20 µin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 1 | Through Hole | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 39 | All | 0.335 " | 8.51 mm | |||||
Samtec Inc. | 0.095 in | 2.41 mm | 3 µin | 0.076 µm | Gold | Receptacle | Board to Board Cable | 2.54 mm | 0.1 in | Push-Pull | 0.51 µm | 20 µin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 1 | Through Hole Right Angle | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 39 | All | |||||
Samtec Inc. | 3 µin | 0.076 µm | Gold | Receptacle | Board to Board Cable | 3.15 mm | 0.124 " | Push-Pull | 0.51 µm | 20 µin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 3 | Through Hole | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 117 | All | 0.335 " | 8.51 mm | 2.54 mm | 0.1 in | |||
Samtec Inc. | 0.095 in | 2.41 mm | Tin | Receptacle | Board to Board Cable | 2.54 mm | 0.1 in | Push-Pull | 0.76 Ám | 30 Áin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 1 | Through Hole Right Angle | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 39 | All | |||||||
Samtec Inc. | Tin | Receptacle | Board to Board Cable | 2.64 mm | 0.104 in | Push-Pull | 0.76 Ám | 30 Áin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 2 | Through Hole | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 78 | All | 0.335 " | 8.51 mm | 2.54 mm | 0.1 in | |||||
Samtec Inc. | Tin | Receptacle | Board to Board Cable | 2.54 mm | 0.1 in | Push-Pull | 0.76 Ám | 30 Áin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 3 | Through Hole Right Angle | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 117 | 0.295 in | 7.5 mm | 2.54 mm | 0.1 in | 78 | |||||
Samtec Inc. | Tin | Receptacle | Board to Board Cable | 10 mm | 0.394 in | Push-Pull | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | 1 | Through Hole | Phosphor Bronze | Black | -55 °C | 105 ░C | Solder | Forked | 39 | All | 0.335 " | 8.51 mm | ||||||||||
Samtec Inc. | Tin | Receptacle | Board to Board Cable | 2.64 mm | 0.104 in | Push-Pull | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | 0.1 in | 2.54 mm | 2 | Through Hole | Phosphor Bronze | Black | -55 °C | 105 ░C | Solder | Forked | 78 | All | 0.335 " | 8.51 mm | 2.54 mm | 0.1 in | ||||||||
Samtec Inc. | 3 µin | 0.076 µm | Gold | Receptacle | Board to Board Cable | Push-Pull | 0.51 µm | 20 µin | UL94 V-0 | Square | 4.7 A | Liquid Crystal Polymer (LCP) | Gold | 0.1 in | 2.54 mm | 2 | Surface Mount | Phosphor Bronze | Black | -55 °C | 125 °C | Solder | Forked | 78 | All | 0.335 " | 8.51 mm | 2.54 mm | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 7.87 | |
| 10 | $ 7.08 | |||
| 100 | $ 6.33 | |||
| 500 | $ 5.30 | |||
| 1000 | $ 4.69 | |||
Description
General part information
SSW-139 Series
39 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold
Documents
Technical documentation and resources