48-6574-16

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

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Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	7	$ 85.95

General part information

48 (2 x 24) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

Parameters and characteristics commom to parts in this series

Specification	48-6574-16	48-6574 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	10 çin	10 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 çm
Contact Finish Thickness - Post	10 çin	10 çin
Contact Finish Thickness - Post	0.25 çm	0.25 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole
Number of Positions or Pins (Grid)	48	48
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	0.11 in	0.11 in
Termination Post Length	2.78 mm	2.78 mm
Type	15.24 mm	15.24 mm
Type	DIP, ZIF (ZIP)	DIP, ZIF (ZIP)
Type	0.6 "	0.6 "

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Termination	Pitch - Post	Pitch - Post	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Material - Mating	Contact Finish - Post	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Housing Material	Current Rating (Amps)	Mounting Type	Pitch - Mating	Pitch - Mating	Material Flammability Rating
Aries Electronics 48-6574-16	Solder	2.54 mm	0.1 in	15.24 mm	DIP, ZIF (ZIP)	0.6 "	10 çin	0.25 çm	Beryllium Copper	Closed Frame	10 çin	0.25 çm	Gold	Beryllium Copper	Gold	0.11 in	2.78 mm	48	Polyphenylene Sulfide (PPS), Glass Filled	1 A	Through Hole	0.1 in	2.54 mm	UL94 V-0
Aries Electronics 48-6574-18	Solder	2.54 mm	0.1 in	15.24 mm	DIP, ZIF (ZIP)	0.6 "	10 çin	0.25 çm	Beryllium Copper	Closed Frame	10 çin	0.25 çm	Gold	Beryllium Copper	Gold	0.11 in	2.78 mm	48	Polyphenylene Sulfide (PPS), Glass Filled	1 A	Through Hole	0.1 in	2.54 mm	UL94 V-0
Aries Electronics 48-6574-10	Solder	2.54 mm	0.1 in	15.24 mm	DIP, ZIF (ZIP)	0.6 "	10 çin	0.25 çm	Beryllium Copper	Closed Frame	10 çin	0.25 çm	Gold	Beryllium Copper	Gold	0.11 in	2.78 mm	48	Polyphenylene Sulfide (PPS), Glass Filled	1 A	Through Hole	0.1 in	2.54 mm	UL94 V-0
Aries Electronics 48-6574-11	Solder	2.54 mm	0.1 in	15.24 mm	DIP, ZIF (ZIP)	0.6 "	10 çin	0.25 çm	Beryllium Copper	Closed Frame	10 çin	0.25 çm	Gold	Beryllium Copper	Gold	0.11 in	2.78 mm	48	Polyphenylene Sulfide (PPS), Glass Filled	1 A	Through Hole	0.1 in	2.54 mm	UL94 V-0