CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Contact Material - Mating | Contact Finish - Post | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Housing Material | Current Rating (Amps) | Mounting Type | Pitch - Mating | Pitch - Mating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6574-16 | Solder | 2.54 mm | 0.1 in | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 10 çin | 0.25 çm | Beryllium Copper | Closed Frame | 10 çin | 0.25 çm | Gold | Beryllium Copper | Gold | 0.11 in | 2.78 mm | 48 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 |
Aries Electronics 48-6574-18 | Solder | 2.54 mm | 0.1 in | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 10 çin | 0.25 çm | Beryllium Copper | Closed Frame | 10 çin | 0.25 çm | Gold | Beryllium Copper | Gold | 0.11 in | 2.78 mm | 48 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 |
Aries Electronics 48-6574-10 | Solder | 2.54 mm | 0.1 in | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 10 çin | 0.25 çm | Beryllium Copper | Closed Frame | 10 çin | 0.25 çm | Gold | Beryllium Copper | Gold | 0.11 in | 2.78 mm | 48 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 |
Aries Electronics 48-6574-11 | Solder | 2.54 mm | 0.1 in | 15.24 mm | DIP, ZIF (ZIP) | 0.6 " | 10 çin | 0.25 çm | Beryllium Copper | Closed Frame | 10 çin | 0.25 çm | Gold | Beryllium Copper | Gold | 0.11 in | 2.78 mm | 48 | Polyphenylene Sulfide (PPS), Glass Filled | 1 A | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 |